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Contact: Miss. Dana
Company: Dongguan Ziitek Electronic Materials & Technology Ltd.
Building B8, Industry District Ⅱ, Xicheng, Hengli Township, Dongguan City
Dongguan 523000
China
Phone: 86-181-53789196
Fax: 86-181-53789196
E-Mail: Send Inquiry Member for over 1 year
Date/Time:  2/15/23 9:26 GMT
 

0.95 W/mK Chomerics T725 replacing ZIITEK Thermal Conductive PCM Phase Chan

0.95 W/mK Chomerics T725 replacing high performance ZIITEK thermal conductive
PCM phase change materials T725P For IGBTs



T725P series is low melting point thermal interface material. At 50℃, T725P
series begins to soften and flow, filling the microscopic irregularities of
both the thermal solution and the integrated circuit package surface, thereby
reducing thermal resistance.T725P series is a flexible solid at room
temperature and freestanding without reinforcing components that reduce thermal
performance.

T725P Series shows no thermal performance degradation after 1,000
hours@130℃,or after 500 cycles, from -25℃ to 125℃.The material softens and
does not fully change state resulting in minimal migration (pump out)at
operating temperatures.




Applications Include:


> High Frequency Microprocessors
> Notebook and Desktop PCs
> Computer Serves
> Memory Modules
> Cache Chips
> IGBTs



Features:



For Lowest Thermal Resistance :
> 0.014℃-in² /W thermal resistance
> Naturally tacky at room temperature,
no adhesive required
> No heat sink preheating required



Typical Properties of T725P
Series
Product Name TICTM805P Testing standards
Color Pink Visual
Composite Thickness 0.005"
(0.126mm)
Thickness Tolerance ±0.0008"
(±0.019mm)
Density 2.2g/cc Helium Pycnometer
Work Temperature -25℃~125℃  
phase transition temperature 50℃~60℃  
Thermal conductivity 0.95 W/mK ASTM D5470 (modified)
Thermal lmpedance @ 50 psi(345 KPa) 0.024℃-in²/W ASTM D5470 (modified)
0.15℃-cm²/W


Standard Thicknesses:


0.005"(0.127mm)



Standard Sizes:


10" x 16"(254mm x 406mm) 16" X 400' (406mm X 121.92M)
TIC™800 series are supplied with a white release paper and a bottom liner.
TIC800™ series is available in kiss cut an extended pull tab liner or
individual die cut shapes.

Peressure Sensitive Adhesive:


Peressure Sensitive Adhesive is not applicable for TIC™800 series products.

Reinforcement:
No reinforcement is necessary.



0.95 W/mK Chomerics T725 replacing ZIITEK Thermal Conductive PCM Phase Change
Materials T725P For IGBTs 0

Why Choose us ?



1.Our value message is'' Do it right the First time, total quality control''.

2.Our core competencies is thermal conductive interface materials

3.Competitive advantage products.

4.Condidentiality agreement Bussiness Secrect Contract

5.Free sample offer

6.Quality assurance contract
0.95 W/mK Chomerics T725 replacing ZIITEK Thermal Conductive PCM Phase Chan
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