Copper Polishing Slurry

According to the characteristics of copper material and high requirements of
the 3C fabricate, Kona nano alumina water-based polishing slurry provides a
good surface finish with no compromise on the polishing rate.

POLISHING SLURRY FOR 3C COPPER ACCESSORIES
Polishing Slurry for 3C Copper Accessories
1
Copper is a soft metal (Mohs hardness 3), and it is a highly reactive metal and
it oxidized very easily. That increases the difficulty of polishing Copper
Accessories for computer and mobile phone.

2
Our copper cmp slurry is designed for the 3C Copper Accessories polishing
process (which is mostly a CMP process ), it is a water-based nano alumina
polishing slurry added an additive special for the characteristic of copper.

3
Kona Copper Polishing Slurry provides a mirror-like surface finish with no
compromise on removal rate, and also can achieve a good gloss value, such as
hundreds gu.

DETAILS OF COPPER POLISHING SLURRY
Copper has good electrical conductivity, thermal conductivity and corrosion
resistance, low hardness, strong ductility and good gloss, and is widely used
in 3C industry, especially in various mobile phone accessories.

Copper polishing has not only the requirements of flatness and roughness, but
also the requirements of glossiness.

Kona provide both nano alumina based and colloidal silica based polishing
slurry for copper accessories.

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