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Contact: sales
Company: JIMA Copper
No.275,Guoding East Road,Yangpu District,Shanghai Municipality
Shanghai 200000
China
Phone: 86-21-35322273
E-Mail: Send Inquiry
Date/Time:  11/18/21 7:14 GMT
 

Flexible Printed Circuit ED Copper Thin Sheet , 35um ID76mm Copper Foil Pap

very low profile thickness 35um ED copper foil FOR Flexible Printed Circuit.




Surface: Mill,mirror,brush,hair line,checkered .etc
Main Purpose: Copper strip can be made to do all sorts of deep drawing and
bending stress components, such as manufacturing pins,rivets, gasket, nuts,
conduits, the barometer spring, screen, radiator parts, etc
The product surface is black or red, has lower surface roughness,high
density, high bending resistance and good etching performance, used for
Flexible Copper Clad Laminate(FCCL),Fine Circuit FPC,LED coated crystal thin
film.



Products usage:

- Flexible Printed Circuit.

- LED layer of HDI .



ED copper foil Specifications.



1) Thickness Range: 0.035mm.

2) standard width:1290mm.

3) ID: 76 mm,152 mm.

4) Cu Content: 99.8%.



VLP ED Copper Foil Characteristics.



1. Zinc-free.

2. Excellent physics of high elongation Performance.





Difference between rolled copper foil and electrolytic copper foil.





Process is difference: rolled copper foil (Rolling process),ED copper foil
(Electrodeposition process).



Surface treatment width:rolled copper foil be limited by Surface treatment
widest effective width of 520mm.







Typical properties of VLP-S-B/R copper foil for FPC or inner layer of HDI.



Classification



Unit Requirement Test Method
Foil Designation / 1 H M 1 IPC-
4562A
Nominal thickness / 10um 12um 1/2 OZ (18um) 3/4 OZ(25um)
1 OZ(35um) IPC-4562A
Area Weight g/㎡ 98±4 107±4 153±5 228±8 285±10
IPC-TM-650

2.2.12.2

Purity % ≥99.8
IPC-TM-650

2.3.15

Foil Profile Shiny side(Ra) սm ≤2.5 ≤2.5 ≤2.5 ≤2.5
≤2.5
IPC-TM-650

2.3.17

Matte side(Rz) um ≤2.5 ≤2.5 ≤2.5 ≤2.5 ≤2.5
Tensile Strength R.T.(23℃) Mpa ≥300 ≥300 ≥300
≥300 ≥300
IPC-TM-650

2.3.18

H.T.(180℃) Mpa ≥200 ≥200 ≥200 ≥200 ≥200
Elongation R.T.(23℃) % ≥4 ≥5 ≥6 ≥8 ≥10
IPC-TM-650

2.3.18

H.T.(180℃) % ≥5 ≥6 ≥7 ≥8 ≥8
Peel Strength(FR-4) N/mm ≥0.8
IPC-TM-650

2.4.8

Ibs/in ≥4.6
Pinholes&porosity Number No
IPC-TM-650

2.1.2

Anti-oxidizatio , n R.T.(23℃) 180days /
H.T.(200℃) 60 Minutes /
Flexible Printed Circuit ED Copper Thin Sheet , 35um ID76mm Copper Foil Pap
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