Import-Export Bulletin Board  

Home > Offers to Sell > Electronics & Electrical > Passive Components > Other Passive Components

Contact: Rainbow Zhu
Company: Shenzhen Hiner Technology Co.,LTD
Block3,Jinmeiwei First Industrial Park,Xingye West Road Baoan,Shenzhen,Guangdong,CHINA
Shenzhen
China
Phone: 86-0755-23229236
E-Mail: Send Inquiry Member for over 2 years
Date/Time:  7/26/21 6:49 GMT
 

Heat Resistant Anti Static Jedec IC Trays Electronic Components Tray

Heat-Resistant And Anti-Static Jedec IC Trays With Different Temperatures Can Be
Customized For IC Modules


1. Standard Jedec Tray Outline size is 322.6X135.9X7.62mm or 322.6*135.9*12.19mm.
2. The production process is injection molded products.
3. Rich experience and mature design team in the field of injection molding
products, providing one-stop services from design to mold to product packaging


The design of the structure and shape in line with JEDEC international standards
can also perfectly meet the requirements of the carriing components or IC of the
tray, carriing function to meet the requirements of the automatic feeding system,
to achieve the modernization of loading, improve work efficiency.



The Flat cells in the center area of each tray is designed for automatic equipment
to allow the use of vacuum picking up tools. If it is necessary to cancel in
special cases, we can also change the design according to your requirements at the
beginning of the design.



The tray has a 45-degree chamfer to provide the visual indicator of Pin 1
orientation of the IC and prevent the stack of errors, reduce the possibility of
workers making mistakes and maximize the protection of the chip.



Providing a variety of packaging IC design solutions based on your chip, the 100%
custom tray is not only suitable for storing IC but also better protect the chip
storage.We have designed a lot of packaging way, which also contains common BGA,
FBGA, LGAQFN, QFP, PGA, TQFP, LQFP, SoC and SiP, etc.We can provide custom service
for all packaging methods of chip tray.





Material Bake Temperature Surface Resistance
PPE Bake 125°C~Max 150°C 1.0*10E4Ω~1.0*10E11Ω
MPPO+Carbon Fiber Bake 125°C~Max 150°C 1.0*10E4Ω~1.0*10E11Ω
MPPO+Carbon Powder Bake 125°C~Max 150°C 1.0*10E4Ω~1.0*10E11Ω
MPPO+Glass Fiber Bake 125°C~Max 150°C 1.0*10E4Ω~1.0*10E11Ω
PEI+Carbon Fiber Max 180°C 1.0*10E4Ω~1.0*10E11Ω
IDP Color 85°C 1.0*10E6Ω~1.0*10E10Ω
Color, temperature and other special requirements can be customized
Heat Resistant Anti Static Jedec IC Trays Electronic Components Tray 0
Heat Resistant Anti Static Jedec IC Trays Electronic Components Tray
Enlarge Click to Enlarge
SOURCE: Import-Export Bulletin Board (https://www.imexbb.com/)
Report Abuse

Post an Offer to Sell

© 1996-2010 IMEXBB.com. All rights reserved.

IMEXBB.com