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Contact: icicleflow
Company: Dongguan Xunling New Technology Co., Ltd
Room 102, building 1, No. 5, Rome Xianwei West Road, Qingxi Town
Dongguan City 523661
China
E-Mail: Send Inquiry NEW MEMBER
Date/Time:  5/28/26 0:38 GMT
 

LGA-4677 Brazing Water Cooling Plate

Heatsink Material: Copper
Bracket Material: AL6061
Pump Size: 118*78*23.3mm Connector 
(Support Customization): Suitable for 6mm inner pipe
CPU Socket: LGA4677 Brazing Water Cooling Plate
Product Feasture:
Skive copper base for easy heat conduction
Brazing process
Copper skive with high density pin
Outer braided rubber hose
High flow water pump
Low noise design
Customized special fasteners
Low rate of evaporation design
High heat resistance choice(PPS+40%GF housing)
Independent pump design
Item Sspcification
Product descriprion 1U 4677 Brazing cooling plate
Cooling plate size L118*W78*H23.6mm
Socket LGA4677
Pump rated valtage DC12 V
Starting voltage of pump >6V
Shaft core Ceramic
Bearing Ceramic
Rated current of pump 0.6A+/-10%
Rated speed of pump 3100+/-10% RPM
Rated power of pump 7.2W
Working temperature range -10℃ to 40℃
Storage temperature range -20℃ to 60℃
LGA-4677 Brazing Water Cooling Plate
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