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Contact: phonefixNicole
Company: Shenzhen weixiu technology Co.,Ltd
JuGuang E-commerce Industrial Park, Building 8, No.9 Qilin Road, BanTian Street, LongGang District,
shenzhen 518116
China
Phone: 18929708712
Fax: +86 0755-21005627
E-Mail: Send Inquiry Member for over 1 year
Date/Time:  4/20/23 7:29 GMT
 

MIJING Z20 Pro middle layer reballing platform

MJ Z20 Pro Phone motherboard middle layer frame tin planting platform with
stencil steel mesh for Phone X-14 Pro Max motherboard soldering repair.

Product Features:
Phone X-14 PRO MAX BGA reballing fixture tool.
Used for positioning and reballing Phone X-14 Pro Max PCB BGA parts.
Convenient and faster for reballing BGA without any damage.
Offer you best solution for Phone X-14 Pro Max BGA reballing and repairing.

How to install:
Install the Phone X-14 Pro Max main board on the platform
Cover the Phone X-14 Pro Max BGA reballing stencil on mainboard
Evenly spread tin on the cover of the reballing stencil
Remove the reballing stencil cover
Take out the motherboard and cooperate with the hot air gun to solidify the
tin point.

Minimum Order: 1 pieces

MIJING Z20 Pro middle layer reballing platform
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