COIN417/R

WLP+ASIC Uncooled Thermal Modules

COIN series uncooled thermal module integrates the wafer-level package detector
produced by GST, ASIC chip for imaging processing, micro-motion electromagnetic
threshold shutter and general optical interface. It is beneficial to OEM
customers for secondary development and suitable for the development and
integration of thermal imager in various applications.

400x300IR resolution

17μm Pixel Pitch

＜3s Start-up Time

＜40mK NETD
COIN417 integrates 400x300@17μm wafer level package (WLP) infrared imaging
detector, high performance signal processing circuit and image processing
algorithm.

The COIN417 infrared module features in sharp and crisp thermal image
presentation, compact size and low cost. It also has an optional thermographic
function with measurement range from -20℃~550 ℃ for industrial temperature
measurement.

Until now, we have provided our customers with various mature and stable
infrared thermal imaging solutions. It’s easier for COIN series thermal
imaging common module to be integrated into more terminal products and greatly
reduces the cost for customers.


* All specifications are subject to the actual product. Guide sensmart
reserves the right to change the technical specifications without notice or
liability to you.

For more information about thermal camera module price and infrared camera
core, please feel free to contact us!

Minimum Order: 50000 sets

Click to Enlarge