Precision Laser Micromachining Machine

Precision Laser Micromachining Machine  Ultrafast Laser Micromachining
Systems
Chanxan provides advanced laser micro processing machines for high-precision
cutting, drilling, dicing, grooving, etching and surface structuring of
difficult-to-process materials. Our laser micromachining systems are designed
for manufacturers that require micron-level accuracy, clean edges, low heat
affected zones and stable production performance.
From FPC, PCB, PI film and PET film processing to wafer dicing, glass cutting,
ceramic drilling and semiconductor material micromachining, Chanxan offers
nanosecond, picosecond and femtosecond laser systems to match different
material properties, production speeds and accuracy requirements.
As an experienced industrial laser equipment manufacturer, we support
customers with process testing, machine configuration, automation integration
and long-term technical service.
Our Laser Micro Processing Machine Series
Nanosecond Laser System for High-Speed Industrial Micromachining
The nanosecond laser system is suitable for high-speed, high-precision
processing of PCB, FPC, PI, ceramics, camera modules, metals, polymers and
other industrial materials. It offers stable cutting, drilling and etching
performance for manufacturers that need efficient micro processing with
reliable dimensional consistency.
With micron-level motion control, optimized thermal management and automated
system integration, the Nanosecond Laser System is a practical choice for
high-volume electronics and precision component production.
Recommended applications:
·   PCB and FPC cutting
·   Camera module processing
·   Ceramic substrate cutting
·   PI and polymer material processing
·   Thin metal and alloy micromachining
Picosecond Laser System for Clean Cold Processing
The picosecond laser processing machine is designed for materials that are
sensitive to heat, carbonization or edge deformation. With ultrashort pulse
technology, the system reduces thermal diffusion and helps achieve cleaner
edges, smaller heat affected zones and better processing quality.
Chanxan’s Picosecond Laser System is widely used for FPC, PI films, LCP
materials, foils, polarizers, flexible OLED materials and precision electronic
components.
Recommended applications:
·   FPC cover film cutting
·   PI film window opening
·   LCP material processing
·   Thin foil cutting and drilling
·   Flexible electronics micromachining
·   Semiconductor packaging material processing
Femtosecond Laser System for Ultra-Precision Micro Processing
For high-value materials and extremely strict accuracy requirements, the
femtosecond laser micromachining system provides near-zero thermal impact and
excellent edge quality. It is suitable for advanced ceramics, sapphire, glass,
silicon wafers, medical polymers, high-performance alloys and other difficult
materials.
The Femtosecond Laser System is recommended for customers that require ultra-
precision laser micro processing with minimal heat conduction, reduced micro-
cracking and stable repeatability.
Recommended applications:
·   Sapphire and UTG processing
·   Silicon wafer micromachining
·   Advanced ceramic cutting
·   Medical device component processing
·   Micro drilling and fine structuring
·   High-precision research and production applications

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