Automatic Wafer Cleaning Device After Light Resistance

Application field: removal of photoresistance/wafer cleaning after grinding
Wafer size: 150mm&200mm&300mm (customizable)
Process indicators: wafers with processes above 19nm can be cleaned
Automatic Wafer Plating Machine features:
Equipped with 2 or 3 Load ports
Industrial control machine touch screen operation control, convenient and fast
Use genuine industrial iot configuration software for control and monitoring
Support SECS/GEM communication protocol and data transmission
Horizontal chamber, no cross contamination
Equipped with two-arm wafer handling manipulator imported from Japan, efficient
and stable
Equipped with up to 8 cleaning chambers (customized)
Cleaning liquid independent control, no cross contamination

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