FPC circuit board laser processing equipment

1. Strong compatibility: can cut/drill/mark, reduce procurement costs, save
plant space;
2. Zero consumables: non-contact laser process, zero tool loss;
3. Second-level line change: hundreds of sets of processes are stored in
advance, and the order switching time is less than 1 minute;
4. Invisible loss reduction: heat-affected zone ≤10μm, providing material
utilization improvement;
FPC board laser processing equipment is specially designed for high-precision
processing of flexible circuit boards. It integrates three-in-one functions of
laser cutting, drilling and marking. It adopts non-contact ultrafast laser
technology to achieve micron-level processing accuracy (line width ≤15μm),
heat-affected zone ≤10μm, and eliminates material deformation and
carbonization. Equipped with intelligent process library and visual
positioning, it supports the switching of complex graphics from micro-holes to
multi-layer blind grooves in seconds, and adapts to the efficient production of
fragmented orders.

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