Laser wafer marking equipment

Equipment Functions: This Laser wafer marking equipment utilizes high-
precision UV laser cold processing technology, specifically designed for
efficient marking of semiconductor wafers. Equipped with an intelligent vision
positioning and automated control system, it can permanently and precisely mark
various wafers, including silicon, SiC, and GaN, with features such as QR
codes, serial numbers, wafer IDs, and anti-counterfeiting markings. The
markings are highly clear, easily recognizable, and durable.
The processing is free from mechanical stress, thermal damage, and
contamination, ensuring wafer integrity and device performance, meeting the
traceability requirements of automotive-grade, high-reliability chips. The
equipment operates stably and is highly adaptable, seamlessly integrating with
automated production lines to provideefficient, precise, and reliable marking
solutions for semiconductor manufacturing.

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