Passive Components

Model Number: UIYCT25AN18 Frequency Range: DC-18GHz VSWR:1.35 Power: 25W Connector Type: N Male Impedance: 50Ω

Minimum Order: 1 bags

Model Number: UIYCT50ANF6 Frequency Range: DC-6GHz Power:50W VSWR:1.25 Connector Type: N Female Impedance: 50Ω

Minimum Order: 1 bags

Model Number: UIYCT80ANF6 Frequency Range: DC-6GHz Power: 80W VSWR: 1.25 Connector Type: N Female Impedance: 50Ω

Minimum Order: 1 bags

Model Number: UIYCT100AN3 Frequency Range: DC-3GHz Power: 100W VSWR: 1.15 Connector Type: N Male Impedance: 50Ω

Minimum Order: 1 bags

Model Number: UIYCT200AN3 Frequency Range: DC-3GHz Power:200W VSWR:1.15 Connector Type: N Male Impedance: 50Ω

Minimum Order: 1 bags

Model Number: UIYCI4550A400T512SF Frequency Range: 400~512MHz Bandwidth: 30% Insertion Loss: 0.5dB Isolation: 20dB VSWR:1.25 Forward Power: 100W Reverse Power: 30W Connector Type: SMA-F Temperature: -30~+70℃ Dimension: 45×50×24mm

Minimum Order: 1 bags

Layer Count & Material Layers 1-8Layers Maximum Panel Size 19.6*31.0 inch Maximum Single Unit Size 9inch*14inch （limitation is 9inch*23inch） Minimum Panel Size 9.0*12.0 inch Board Size Tolerance ±0.1mm Maximum Finished Board Thickness 0.80mm Minimum Finished Board Thickness 0.05mm Trace/Line Minimum Line Width for Inner Layers 3mil Minimum Line Spacing for Outer Layers 3.5mil Minimum Line Width for Outer Layers 3mil The Copper Thickness for Inner Layers ≤2OZ Minimum Line Spacing for Inner 3mil The Copper Thickness for Outer Layers ≤3OZ Drilling Minimum Hole Diameter 0.15mm Minimum Distance from Hole to Board Outline 8mil Maximum Hole Diameter 6.4mm Minimum Size for Hole Ring 4mil （Partially 3.2mil） Hole Diameter Tolerance ±2mil The Minimum BGA Bonding Pad Design ≥8mil (7mil is the Limitation) The Distance from Hole to Hole 10mil The Minimum SMT Design ≥7mil Solder Mask SM Bridge Width ≥4mil Minimum Width of Legend 4mil Minimum Size of SM Window 3mil（Partially 2.5mil） Minimum Hight of Legend 23mil The Minimum Distance from SM Window to Other Outline 3mil Surface Finished HASL、ENIG、ENEPIG、Soft bonding gold(Soft Gold Plating)、Hard Gold Plating、 Immersion Silver、OSP、Immersion Tin、ENIG+OSP、ENIG+G/F Impedance Whether it is capable of impedance testing Yes, it capable, it have

Minimum Order: 1 bags

Layer Count & Material Layers 1-8Layers Maximum Panel Size 19.6*31.0 inch Maximum Single Unit Size 9inch*14inch （limitation is 9inch*23inch） Minimum Panel Size 9.0*12.0 inch Board Size Tolerance ±0.1mm Maximum Finished Board Thickness 0.80mm Minimum Finished Board Thickness 0.05mm Trace/Line Minimum Line Width for Inner Layers 3mil Minimum Line Spacing for Outer Layers 3.5mil Minimum Line Width for Outer Layers 3mil The Copper Thickness for Inner Layers ≤2OZ Minimum Line Spacing for Inner 3mil The Copper Thickness for Outer Layers ≤3OZ Drilling Minimum Hole Diameter 0.15mm Minimum Distance from Hole to Board Outline 8mil Maximum Hole Diameter 6.4mm Minimum Size for Hole Ring 4mil （Partially 3.2mil） Hole Diameter Tolerance ±2mil The Minimum BGA Bonding Pad Design ≥8mil (7mil is the Limitation) The Distance from Hole to Hole 10mil The Minimum SMT Design ≥7mil Solder Mask SM Bridge Width ≥4mil Minimum Width of Legend 4mil Minimum Size of SM Window 3mil（Partially 2.5mil） Minimum Hight of Legend 23mil The Minimum Distance from SM Window to Other Outline 3mil Surface Finished HASL、ENIG、ENEPIG、Soft bonding gold(Soft Gold Plating)、Hard Gold Plating、 Immersion Silver、OSP、Immersion Tin、ENIG+OSP、ENIG+G/F Impedance Whether it is capable of impedance testing Yes, it capable, it have

Minimum Order: 1 bags

Place of Origin:Shenzhen, China Brand Name:FAST PCB Technology Copper Thickness:0.5-6oz Board Thickness:0.4-4.2mm Min. Hole Size:0.1-6.5mm Min. Line Width:3mil Min. Line Spacing:3mil Surface Finishing:Flash gold(electroplated gold)、ENIG、Hard gold、Flash gold、 HASL Lead free、OSP、ENEPIG、Soft gold、 Immersion silver、Immersion Tin、ENIG+OSP,ENIG+Gold finger,Flash gold(electroplated gold)+Gold finger,Immersion silver+Gold finger,Immersion Tin+Gold finge Max Layer:48L PCB Standard:IPC-A-600 Solder Mask:Green,Black,Blue,Red, White,Yellow, Matt Green，Matt Black, Matt Blue Legend:White, Black,Red,Yellow

Minimum Order: 1 bags

Place of Origin:Shenzhen, China Brand Name:FAST PCB Technology Copper Thickness:0.5-6oz Board Thickness:0.4-4.2mm Min. Hole Size:0.1-6.5mm Min. Line Width:3mil Min. Line Spacing:3mil Surface Finishing:Flash gold(electroplated gold)、ENIG、Hard gold、Flash gold、 HASL Lead free、OSP、ENEPIG、Soft gold、 Immersion silver、Immersion Tin、ENIG+OSP,ENIG+Gold finger,Flash gold(electroplated gold)+Gold finger,Immersion silver+Gold finger,Immersion Tin+Gold finge Max Layer:48L PCB Standard:IPC-A-600 Solder Mask:Green,Black,Blue,Red, White,Yellow, Matt Green，Matt Black, Matt Blue Legend:White, Black,Red,Yellow

Minimum Order: 1 bags

Specifications: 1 All dimensions are in MM. 2 Fabricate per IPC-6012A Class2. 3 Materials: 3.1 Dielectric: FR4 Per IPC or equivalent 3.2 Min Tg: 170DEG 3.3 Copper: As per stack up 3.4 UL Rating: 94V0 Minimum 4 Surface finish: ENIG 5 Solder mask material should meet all requirement of the IPC-SM-840E and shall be green in color and applied over bare copper. Vendor may edit solder mask and paste mask as needed. 6 Editing of existing copper layers shall require customer approval. 7 Silkscreen legend to be applied per layer stackup using white non- conductitive epoxy ink. 8 100% continuity testing using database netlist shall be performed.Vendor to identify test passed in secondary side. 9 Vendor to mark date code and logo in legend secondary side. 10 Bow and twist shall not exceed 1.0% of longest side. 11 Vendor to provide panel drawing for customer approval before production PCB report have to include the following information: 1 Measurement: outline dimension, pcb thickness, plating thickness, actual hole size dimension, copper thickness, hole wall copper thickness, solder mask thickness, track and space width, warp and twist percentage; 2 Test and inspection: electrical test result, solder ability test result, visual inspection test result, micro section pcb with resin; 3 Other: date code, quantity etc.

1.Company introduction Abis Circuits Co.,Ltd is a professional PCB manufacturing in Shenzhen, China which is focus on double side, Multilayer and HDI PCB mass production. Our company was established in 2006. We have two factories together and offer a wide range of services from quick turn, PCB prototypes to large volume PCB manufacturing. Our aim is help the clients gain more competitive strength and bring more mutual benefit to each other. All clients will be served well. 2.Factory Operation plant space: (I) 10000 Square meters (II) 60000 Square meters Employees: (I) 300 Man Powers (II) 900 Man Powers Eng. Technical: (I) 20 QA QC Engineers (II) 60 QA,QC Engineers 3.Technological capability No Items Capability 1 Layers 1-20 2 Base Material FR4, High Tg FR4, Halogen Free, Isola, Rogers, Aluminium, etc 3 Max. Size 600mm x 1200mm 4 Finished Board Thickness 0.2mm-8.0mm 5 Copper Thickness 0.5oz-10oz 6 Surface Finishing HASL, Lead Free HASL, Immersion tin, Immersion gold, Gold plating, Immersion silver, OSP, etc. 7 Min. Trace Width/Space 0.075/0.075mm 8 Min. Finish Holes Size 0.1mm for mechanical holes 9 Diameter Tolerance 0.05mm for mechanical 10 Registration 0.075mm for mechanical 11 Soldermask Color Green, White, Black, Red, Yellow, Blue 12 Silkscreen Color White, Black, Yellow, Blue 13 Impedance Control +/-10% 14 Profiling Punching Routing, V-CUT, Chamfer 15 Special Holes Blind/Buried holes, Countersunk holes 16 Reference Standard IPC-A-600H Class 2, Class 3, TS16949 17 Certificate ISO14001, ISO9001, UL, cUL 18 PCB Package Vacuum & Carton

Application:Memory package,Memory packaging substrate,Dram/SSD/LPDDR package substrate,Semiconductor package; When you send inquiry us,Pls be know that we have to get the following : 1-PCB production sepc. information; 2-Gerber files(PCB designer/engineer can export it from your layout software,also send us drilling file) 3-Quantity request,Including sample; 4-For multilayer thin FR4 PCB,please also provide us layer stack-up information; Spec.of pcb production: Mini.Line space/width:1mil (25um) Finished thickness:FR4 (0.1-0.4mm) finished thickness; Material brand:Mainly brand:SHENGYI,Mitsubishi(BT- FR4),mitsuiseiki,O , hmegaPly,Ticer,AMC,Isola,AGC,Neclo,Rogers,Taconic, , Others; Surface finished:Mainly immersion gold,ENEPIG,support customize such as OSP/Immersion silver,tin,more; Copper:0.5oz or Customize; Layer:1-6 layer (Customize); Soldermask:Green or Customize (Brand:Soldermask:TAIYO INK,ABQ) Improved tenting process:20/20um;

Introduction of PAGOODA solid electrolytic capacitors: Operating temperature range: -55~+105℃ for 2000 hours. Rated voltage range: 10V~100VDC. Nominal capacitance range: 18μF~2700uF Suitable for motherboard, VGA, DC/DC converter, switching power supply, QC protocol mobile phone charger, PD protocol charger. Meet RoHS requirements. Solid electrolytic capacitors can make larger capacity with smaller volume, Higher stability, longer life, lower ESR and high rated ripple current. Solid electrolytic capacitors can continue to work stably in high temperature environments, and the use of solid aluminum electrolytic capacitors can directly improve the performance of the motherboard. At the same time, due to its stable impedance in a wide temperature range, it is suitable for power supply filtering. It can effectively provide stable and abundant power, which is especially important in overclocking. WeChat: pskj13622678159 whatsapp: +86 13794963328 Alibaba International Station: https://mlccpagooda.en.alibaba.com/minisiteent , rance.html? spm=a2700.details.cordpanyb.2.766f6 , 411xYsc5I&from=detail&productId=1600474189 915

Minimum Order: 4000