Electronic & Electrial Accessories

beo-ceramic-substrate/ 99.5% High Thermal Low Dielectric Beryllium Ceramic Substrate BeO ceramics Beryllium oxide is a kind of white amorphous powder which is not soluble in water. Due to its extremely high melting point and excellent thermal conductivity, it is generally used in microwave high-power electric vacuum devices and microelectronic packaging devices. When your application requires a material that combines high thermal conductivity and electrical resistivity, consider the benefits of using BeO ceramics.BeO is flexible in applications and superior in performance. We,Coraynic process beryllium oxide powder by pressing, sintering or extruding it into a variety of customized shapes or forms that deliver exceptional thermal properties. Beryllium oxide thermal ceramics are frequently used in high-performance semiconductor applications, microwave devices, heat sinks, electronics packaging, vacuum tubes, gas lasers and magnetrons. BeO Ceramic Substrate materials are ideal in thermal management applications when product design considerations include: • Miniaturizing the physical size of the device or enclosure • Exposing the component to high ambient temperatures • Airflow or liquid cooling is not possible or is prohibitively expensive • Applications that require a ceramic which insulates against electricity • Melting and sintering operations at very high temperatures for crucibles BeO CERAMIC SUBSTRATE STANDARD SIZE thickness(mm) L*w (mm L*W (mm) L*W(mm) L*W(mm) 0.385 2”*2” 50.8*50.8mm 3”*3” 76.2*76.2mm 4”*4” 100*100mm 4.5”*4.5” 114.3*114.3mm 0.5 2”*2” 50.8*50.8mm 3”*3” 76.2*76.2mm 4”*4” 100*100mm 4.5”*4.5” 114.3*114.3mm 0.635 2”*2” 50.8*50.8mm 3”*3” 76.2*76.2mm 4”*4” 100*100mm 4.5”*4.5” 114.3*114.3mm 1.0 2”*2” 50.8*50.8mm 3”*3” 76.2*76.2mm 4”*4” 100*100mm 4.5”*4.5” 114.3*114.3mm 1.5 2”*2” 50.8*50.8mm 3”*3” 76.2*76.2mm 4”*4” 100*100mm 4.5”*4.5” 114.3*114.3mm With high thermal conductivity, high melting point (2530 ± 10°C), high strength, high insulation, high chemical and thermal stability, low dielectric constant, low dielectric loss and good process adaptability, beryllium oxide ceramics are widely used in the fields of special metallurgy, vacuum electronics, nuclear technology, microelectronics and optoelectronics. Especially in high-power semiconductor components, integrated circuits, microwave electric vacuum devices and nuclear reactors, BeO ceramics is the mainstream ceramic material for the preparation of high thermal conductivity components. Beryllium oxide ceramics BeO ceramic substrate Having the characteristics of low dielectric constant, low microwave loss, high strength, excellent thermal conductivity, high processing precision, and good consistency, beryllia oxide rod can be applied to a traveling wave tube to support its spiral structure and to provide a good cooling channel. Why choose Coraynic Technology –Sufficient supply –Completive price –Excellent performance –Good service –Top-quality raw material –Prompt delivery Stock and transportation condition: Before transporting, check whether the packaging container is complete and sealed. During transportation, ensure that the container does not leak, collapse, fall or damage. It is strictly forbidden to mix with acids, oxidants, foods and food additives. Transport vehicles should be equipped with leakage emergency handling equipment when transporting. During transportation, it should be protected from exposure, rain and high temperature. When transporting by road, follow the prescribed route and do not stay in residential areas and densely populated areas. Our team can assist with selecting an optimal product for your RF and microwave microelectronics packaging. Contact our engineers for the best solution!

Minimum Order: 10 long tons

Laser Tungsten Copper Bar Tungsten-copper alloy is a pseudo alloy. Tungsten and copper are not miscible. It combines the high thermal conductivity, high melting point, and low thermal expansion coefficient of tungsten with the high thermal conductivity of copper. The ratio of tungsten to copper can be adjusted arbitrarily as WxCuy, where x+y=100. The table below shows only a portion of the commonly used grades. Our tungsten-copper alloy can achieve nearly completely dense, defect-free, fine- grained structure. The helium mass spectrometer leak detection material's airtightness is <5x10-9 Pa/m3.s, which is comparable to foreign products.

Minimum Order: 10 long tons

Silicon aluminum series Silicon aluminum is a metal ceramic material that maximizes the low density and high thermal conductivity of aluminum, while also possessing the low thermal expansion and high thermal conductivity of silicon. It is primarily utilized for aerospace packaging tube shells. Silicon aluminum is a material that substitutes aluminum silicon carbide. While its thermal conductivity is slightly lower than that of aluminum silicon carbide, it has lower hardness and better machining performance. In addition to the grades in the table below, we can also provide gradient silicon aluminum materials.

Minimum Order: 10 long tons

Molybdenum copper series Molybdenum-copper alloy is also a pseudo alloy. Molybdenum and copper are not miscible. It fully combines the high thermal conductivity, high melting point, low thermal expansion coefficient, and high thermal conductivity of molybdenum. The ratio of molybdenum to copper can be adjusted arbitrarily, MoxCuy, where x+y=100. The following table shows only a portion of the commonly used grades. Our molybdenum-copper alloy can achieve almost completely dense, defect-free, fine-grained structure. The air tightness of the helium mass spectrometer leak material is <5x10-9 Pa/m3.s, which is comparable to foreign products. Compared with tungsten copper, molybdenum copper has lower density and better rollability, making it suitable for the production of thin strip products. Additionally, molybdenum copper can be stamped, making it suitable for the cost-effective mass production of heat sink parts.

Minimum Order: 10 long tons

Laser Tungsten Copper Bar Lasers come in many different qualities, and carbon dioxide lasers are still used in certain specific situations. However, solid-state lasers are currently the main type, and semiconductor lasers are the most common. The use of "crystal" oxygen-free copper heat sinks was prevalent over a decade or two ago. The power density was relatively low, and tin was typically used as solder. Oxygen-free copper heat sinks can be utilized, nickel-plated instead of gold-plated, but gold-plated soldering offers better reliability. The tungsten copper bar structure was developed to meet the demands for high power, high reliability, and long lifespan. Early lasers primarily utilized tungsten copper C-Mount structures, which later transitioned to tungsten copper bars. Initially, W85Cu15 was predominant, but currently, W90Cu10 is the main composition. It is suggested to experiment with W93Cu7 in the future. Tungsten copper bars serve as conductors, heat sinks, and chip carriers. Gallium nitride chips are sandwiched between them and soldered with gold-tin solder. Several laser modules utilize tungsten copper bars, varying from a few to dozens of pieces. In the early days, about 10 years ago, the power of laser chips was not high, and the requirements for tungsten copper bars were not stringent. Now, the power is increasing, and the demands for tungsten copper bar size accuracy, thermal expansion coefficient matching, thermal conductivity, and coating bonding are becoming more rigorous. This is mainly evident in the need for the thermal expansion coefficient to be close to gallium arsenide (5.9x10- 6/K), maximizing thermal conductivity, experimenting with diamond composite materials, and enforcing strict control over key surfaces, finishes, edges (R10 microns), and coatings (nickel, gold, platinum, and locally prefabricated gold and tin). A decade ago, we were the sole manufacturer of tungsten copper bars in China, but now many manufacturers are entering this field.

Minimum Order: 10 long tons

Diamond Copper/Aluminum Series Diamond copper is a composite material made of diamond powder and a copper alloy. It utilizes high-quality artificial synthetic diamond powder, which boasts a thermal conductivity of about 1000W/M.K and an extremely low thermal expansion coefficient. Through the appropriate process, the diamond particles and the copper alloy create a metallurgical bonding interface, resulting in the diamond copper composite material possessing outstanding thermal conductivity and a suitable thermal expansion coefficient. Diamond aluminum, similar to diamond copper, has a lower density, but its thermal conductivity is slightly inferior to that of diamond copper. Diamond copper and diamond aluminum are currently the best heat dissipation materials in our company. Single crystal diamond and CVD diamond exhibit high thermal conductivity, but their thermal expansion coefficient is too small. On the other hand, carbon fiber composite materials offer directional thermal expansion and thermal conductivity.

Minimum Order: 10 long tons

CMC, S-CMC, HS-CMC series CMC is a sandwich composite sheet with a core material of molybdenum plate and oxygen-free copper plates on both sides. It was invented by Americans in the 1990s to solve the heat dissipation of F22 fighter power devices. This material combines the characteristics of molybdenum's low thermal expansion coefficient and copper's high thermal conductivity. The surface is covered with oxygen-free copper plates, eliminating the need to worry about airtightness. Additionally, the copper-coated surface facilitates electroplating. S-CMC is a multi-layer CMC with better symmetry. HS-CMC is a multi-layer composite sheet with holes in the core molybdenum plate. The central core hole is filled with oxygen-free copper, enhancing thermal conductivity in the Z direction. This unique variety was developed by our company in collaboration with Kyocera for 5G power devices. Our Ceramic Matrix Composite (CMC) can be stamped into sheet parts and even made into multi-boss heat pipe products. The layer thickness ratio of CMC series materials can be adjusted arbitrarily to obtain different thermal expansion coefficients.

Minimum Order: 10 long tons

CMC, S-CMC, HS-CMC series CMC is a sandwich composite sheet with a core material of molybdenum plate and oxygen-free copper plates on both sides. It was invented by Americans in the 1990s to solve the heat dissipation of F22 fighter power devices. This material combines the characteristics of molybdenum's low thermal expansion coefficient and copper's high thermal conductivity. The surface is covered with oxygen-free copper plates, eliminating the need to worry about airtightness. Additionally, the copper-coated surface facilitates electroplating. S-CMC is a multi-layer CMC with better symmetry. HS-CMC is a multi-layer composite sheet with holes in the core molybdenum plate. The central core hole is filled with oxygen-free copper, enhancing thermal conductivity in the Z direction. This unique variety was developed by our company in collaboration with Kyocera for 5G power devices. Our Ceramic Matrix Composite (CMC) can be stamped into sheet parts and even made into multi-boss heat pipe products. The layer thickness ratio of CMC series materials can be adjusted arbitrarily to obtain different thermal expansion coefficients.

Minimum Order: 10 long tons

CMC, S-CMC, HS-CMC series CMC is a sandwich composite sheet with a core material of molybdenum plate and oxygen-free copper plates on both sides. It was invented by Americans in the 1990s to solve the heat dissipation of F22 fighter power devices. This material combines the characteristics of molybdenum's low thermal expansion coefficient and copper's high thermal conductivity. The surface is covered with oxygen-free copper plates, eliminating the need to worry about airtightness. Aditionally, the copper-coated surface facilitates electroplating. S-CMC is a multi-layer CMC with better symmetry. HS- CMC is a multilayer composite sheet with holes in the core molybdenum plate. The central core hole is flled with oxygen-free copper, enhancing thermal conductivity in the Z direction. This unique variety was developed by our company in collaboration with Kyocera for 5G power devices. Our Ceramic Matrix Composite (CMC) can be stamped into sheet parts and even made into multi-boss heat pipe products. The layer thickness ratio of CMC series materials can be adjusted arbitrarily to obtain different thermal expansion coefficients.

Minimum Order: 10 long tons

Heat sink Features 1.Efficient Heat Dissipation: Designed to transfer and dissipate heat away from critical components to maintain optimal operating temperatures. 2.Various Fin Designs: Available in different fin shapes and configurations to enhance airflow and heat transfer efficiency. 3.Material Options: Typically made from aluminum or copper, with each material offering specific thermal and weight characteristics. 4.Customizable Sizes: Comes in various sizes and forms to fit different devices and applications, from small electronics to large industrial systems. 5.Thermal Performance: Engineered to provide optimal thermal resistance and conductivity, ensuring effective cooling. 6.Ease of Installation: Designed for straightforward mounting and integration with other cooling systems or directly onto components.

Minimum Order: 10 long tons

Heat sink Features 1.Efficient Heat Dissipation: Designed to transfer and dissipate heat away from critical components to maintain optimal operating temperatures. 2.Various Fin Designs: Available in different fin shapes and configurations to enhance airflow and heat transfer efficiency. 3.Material Options: Typically made from aluminum or copper, with each material offering specific thermal and weight characteristics. 4.Customizable Sizes: Comes in various sizes and forms to fit different devices and applications, from small electronics to large industrial systems. 5.Thermal Performance: Engineered to provide optimal thermal resistance and conductivity, ensuring effective cooling. 6.Ease of Installation: Designed for straightforward mounting and integration with other cooling systems or directly onto components.

Minimum Order: 10 long tons

Heat sink Features 1.Efficient Heat Dissipation: Designed to transfer and dissipate heat away from critical components to maintain optimal operating temperatures. 2.Various Fin Designs: Available in different fin shapes and configurations to enhance airflow and heat transfer efficiency. 3.Material Options: Typically made from aluminum or copper, with each material offering specific thermal and weight characteristics. 4.Customizable Sizes: Comes in various sizes and forms to fit different devices and applications, from small electronics to large industrial systems. 5.Thermal Performance: Engineered to provide optimal thermal resistance and conductivity, ensuring effective cooling. 6.Ease of Installation: Designed for straightforward mounting and integration with other cooling systems or directly onto components.

Minimum Order: 10 long tons

Heat sink Features 1.Efficient Heat Dissipation: Designed to transfer and dissipate heat away from critical components to maintain optimal operating temperatures. 2.Various Fin Designs: Available in different fin shapes and configurations to enhance airflow and heat transfer efficiency. 3.Material Options: Typically made from aluminum or copper, with each material offering specific thermal and weight characteristics. 4.Customizable Sizes: Comes in various sizes and forms to fit different devices and applications, from small electronics to large industrial systems. 5.Thermal Performance: Engineered to provide optimal thermal resistance and conductivity, ensuring effective cooling. 6.Ease of Installation: Designed for straightforward mounting and integration with other cooling systems or directly onto components.

Minimum Order: 10 long tons

Heat sink Features 1.Efficient Heat Dissipation: Designed to transfer and dissipate heat away from critical components to maintain optimal operating temperatures. 2.Various Fin Designs: Available in different fin shapes and configurations to enhance airflow and heat transfer efficiency. 3.Material Options: Typically made from aluminum or copper, with each material offering specific thermal and weight characteristics. 4.Customizable Sizes: Comes in various sizes and forms to fit different devices and applications, from small electronics to large industrial systems. 5.Thermal Performance: Engineered to provide optimal thermal resistance and conductivity, ensuring effective cooling. 6.Ease of Installation: Designed for straightforward mounting and integration with other cooling systems or directly onto components.

Minimum Order: 10 long tons