Electronic & Electrial Accessories

GLPOLY Non-silicone thermal gel helps solve thermal management challenge of AI chip detection equipment. GLPOLY is the leading company in developing non-silicone thermal interface materials in China, competing against international top brands. GLPOLY has launched a range of non-silicone thermal material while the peers was researching the materials. In recent years, some peers claimed that they developed performance non-silicone thermal interface materials. When we received inquiry from customer, we could receive grumble about the non-silicone thermal interface materials they bought before. A customer from chip manufacturing company in Hefei, he wanted to select a non-silicone thermal gel for improving thermal management of AI chip detection equipment. in the past several months they had tested six samples, and found that none of them could meet the requirements, either performance or physical properties. For example, in the second half of test, the temperature rise exceeded design requirements. When they took components apart, they found that the non-silicone thermal gel was dried out, leading to thermal runaway and component failures. As a professional non-silicone thermal gel manufacturer, we promised that a genuine non-silicone thermal gel would never dry out within the range of service temperature. I recommended customer test GLPOLY XK-GN30 non-silicone thermal gel. Three days later, customer received sample, then carried out high temperature aging test at 150 Celsius degree for 1000 hours. In the process of test, the temperature was always lower than he expected. Most importantly, XK-GN30 still remained paste state, performing at its best. GLPOLY XK-GN30 non-silicone thermal gel was the only one that could meet his design among the samples he had ever tested. GLPOLY non-silicone thermal gel XK-GN30 is a high performance, liquid gap filling material with excellent reliability. It deflects and fills intricate gap under low compressive forces, decreasing stress on component thus decreasing component failures. GLPOLY non-silicone thermal gel has been applied to amultitude of industries including camera, displayer, laser, high powered LED lighting, head light and more. GLPOLY has partnered with leading enterprises such as LG, DJI, ZTE, Huawei, DT Mible, Quectel, GAC Motor, NIO Motor and Freetech etc, providing them with advanced thermal interface materials and pioneering thermal management solution, helping keep their devices performing at their best and protect customer’s brand reputation.

Minimum Order: 10 long tons

5G brings high efficiency, at the meantime it requires more efficient thermal management solution due to great deal of heat that generated by huge amount of data exchange. GLPOLY has developed a non-curing, non-drip off high performance thermal gel / thermal putty XK-G70 to solve thermal management problems for 5G telecommunication equipment, beating competitive products in China. Heat transfer of 5G telecommunication equipment is a great challenge to thermal gap pad. Comparing with thermal gap filler pad, no matter the thermal resistance, bondline thickness and assembly process, thermal gel / thermal putty provides superior advantages in the limited package. Thermal gel / thermal putty tends to be one of the best thermal management solutions. GLPOLY XK-G70 thermal gel / thermal putty has following superiorities: 1.Thermal conductivity 7.0W/mK, ultra low thermal resistance, bondline thicnkness 0.15mm improve heat transfer; 2.Compatible with high volume, automated dispense process; 3.Aging test at 150 centigrade for 1200hrs; high and low temperature thermal shock for 500 cycles from-40 to 150 centigrade; GLPOLY has introduced automated production lines for XK-G70 thermal putty production to keep consistancy of product. GLPOLY thermal putty has been applied to automotive electronic control unit, drone and consumer electronics in volume production. GLPOLY thermal interface materials provide you with superior design flexibility.

Minimum Order: 10 long tons

GLPOLY Thermal Gap Pad XK-P80-PUTTY Is The Only One That Can Substitute For Fujipoly PG80A Maybe Fujipoly is one of the most famous thermal interface materials manufacturers worldwide, so many thermal management engineers have some reasons to select Fujipoly thermal materials, such as high performance, highly conformable or high reliability. Is it real that domestic products don’t work quite as well? I don’t think so. Taking Fujipoly products as benchmark, GLPOLY has been invested a lot of sources to develop high performance thermal management and made a lot of achievements also. For example, GLPOLY thermal gap pad XK-P80-PUTTY is a high performance gap filling material which provides similar performance to Fujipoly PG80A. One customer wanted to find a high performance thermal gap pad in local market which must be alternative to Fujipoly PG80A. The customer asked for samples from five domestic suppliers, none of them met the requirements. We learned that the biggest problem is hardness and compression. As everyone knew, the higher thermal conductivity, the harder the thermal pad, because we need to fill more thermally conductive powder into resin. The customer designed a 0.3mm gap which filled by a 1.5 mm thick thermal pad, that means a compression rate of 80% is needed. This is the biggest advantage of Fujipoly PG80A. We recommended XK-P80-PUTTY to customer and sent them a sample for testing. One day later, the customer fed back,”I was surpprised, your sample exhibited similar technical data to Fujipoly PG80A, thermal conductivity is 8.0W/mK and compression rate is up to 80%, it perfectly substitutes for PG80A, I will recommend your product to our team.” GLPOLY thermal gap pad XK-P80-PUTTY is high thermal performance, high compression gap filling pad. This material features high thermal conductivity and low thermal impedance, providing effective heat transfer from heat source to heatsink and helps keep your devices cool and performing at their best.

Minimum Order: 10 long tons

Thermal gel is an ideal thermal solution for fragile chip in assembly, replacing Chomerics THERM-A-GAP GEL30. We used to apply thermal gap pad in thermal management, sometimes, there would be some problems. If a certain amount of compression is required, the compressive force may destroy the chip. How can we fix this problem? Here is a example for your reference. A medical equipment consulted with us about thermal management solution. they used a thermal gap pad with a thermal conductivity of 3.6W/mK, the performance is good enough when they tested the thermal pad, but heat dissipating is not as good as expected. The supplier told them the interface contact is not tight enough, and requested customer to place much more compressive forces. Finally, this resulted in destroy to chip. As we learned about this application, we knew the strain was what it mattered. GLPOLY had designed a sort of thermal gel to fix problem like this. We recommended XK-G40 high performance thermal gel with a thermal conductivity of 4.0W/mK which was verified by third party to customer. This material deflects under low compressive force, decreasing stress on component thus decreasing components failure. GLPOLY XK-G40 is high performance, thermally conductive, liquid gap filling material designed to eliminate time consuming hand assembly, decreasing installation costs and reducing customer purchasing complexity. This material is one-component packaged, suitable for automated dispensing system, improving productivity. It provides similar performance to Chomerics THERM-A-GAP GEL30. GLPOLY thermal management materials had been applied to military equipment, automotive electroncis and EV battery pack and ECU. GLPOLY helps keep your devices performing stable with complete portfolio of thermal interface materials including thermal gap, thermal gap filler, thermal paste and silicone-free thermal materials.

Minimum Order: 10 long tons

GLPOLY Thermal Gap Pad XK-P60 Is The Only One That Can Substitute For Fujipoly GR45A Maybe Fujipoly is one of the most famous thermal interface materials manufacturers worldwide, so many thermal management engineers have some reasons to select Fujipoly thermal materials, such as high performance, highly conformable or high reliability. Is it real that domestic products don’t work quite as well? I don’t think so. Taking Fujipoly products as benchmark, GLPOLY has been invested a lot of sources to develop high performance thermal management and made a lot of achievements also. For example, GLPOLY thermal gap pad XK-P60 is a high performance gap filling material which provides similar performance to Fujipoly GR45A. One customer wanted to find a high performance thermal gap pad in local market which must be alternative to Fujipoly GR45A. The customer asked for samples from five domestic suppliers, none of them met the requirements. We learned that the biggest problem is hardness and compression. As everyone knew, the higher thermal conductivity, the harder the thermal pad, because we need to fill more thermally conductive powder into resin. The customer designed a 0.3mm gap which filled by a 1.5 mm thick thermal pad, that means a compression rate of 80% is needed. This is the biggest advantage of Fujipoly GR45A. We recommended XK-P60 to customer and sent them a sample for testing. One day later, the customer fed back,”I was surpprised, your sample exhibited similar technical data to Fujipoly GR45A, thermal conductivity is 8.0W/mK and compression rate is up to 80%, it perfectly substitutes for GR45A, I will recommend your product to our team.” GLPOLY thermal gap pad XK-P60 is high thermal performance, high compression gap filling pad. This material features high thermal conductivity and low thermal impedance, providing effective heat transfer from heat source to heatsink and helps keep your devices cool and performing at their best.

Minimum Order: 10 long tons

Many engineers know that 3M, Fujipoly, Bergquist can provide silicone-free thermal gap pad, but they don’t know who can make it in Chinese local market. GLPOLY had invested a large amount of resources to develop silicone-free thermal gap pad for years. Now we have developed XK-PN series silicone-free thermal pad successfully, taking these top brand as reference samples. We take GLPOLY XK-PN45 and 3M 5500H as example, let us check the comparison. Usually two parameters will be considered carefully---thermal conductivity and thermal impedance for judging the performance of thermal pad. One of our customer requested a silicone-free thermal pad from us which can provide similar thermal performance to 3M 5500H. 3M 5500H was tested by two method, in-house test and ASTM D5470. The thermal conductivity is 3.0W/mK and 2.0W/mK respectively. GLPOLY silicone-free thermal pad was tested by ASTM D5470, an authoritative test method, exhibiting an thermal conductivity of 4.5W/mK. To any professional, this is more reliable. Let us check the thermal impedance. 3M 5500H doesn’t mark the value, but we can calculate according to thermal conductivity and thickness. We figured out an thermal impedance of 0.63℃in2/W for 3M 5500H silicone-free thermal pad. GLPOLY XK-PN45 provides a thermal impedance of 0.18℃in2/W, it’s only one fourth of that of 3M 5500H. obviously, GLPOLY XK-PN45 offers higher thermal performance than 3M 5500H. GLPOLY has been a thermal management materials manufacturer for more than ten years. We have been providing thermal management materials for Huawei, DJI and GAC.

Minimum Order: 10 long tons

GLPOLY thermal gap pad XK-P80 is a dark horse in thermal interface materials industry, designed to solve thermal management problem of 5G telecom equipment. It is constructive to said that XK-P80 thermal gap pad is a preferred thermal solution for thermal management of 5G telecom equipment. 1. Thermal conductivity 8.0W/mK, low thermal resistance; 2. Conformable to component topography, improve thermal contact; 3. Loyal users such as DT Mobile, ZTE, DJI, NIO Motor and more; It was said that there were many thermal interface materials can be applied to 5G telecom equipment thermal management, actually, to many thermal management engineers, it was not easy to find a proper thermal interface materials for 5G telecom applications, they found that performance of most of thermal interface materials were inconsistent with what they claimed, lower performance, low reliability etc., this was true. GLPOLY has always been at the leading edge of technological development of thermal interface materials. In order to fulfill the demand of 5G telecom equipment thermal management, GLPOLY had developed a thermal gap pad with a thermal conductivity of 8.0W/mK. This thermal gap pad had been verified by DT mobile, a leading telecommunication equipment manufacturer in China. No matter the thermal performance, reliability or service life, GLPOLY thermal gap pad XK-P80 could met customer’s requirements. XK-P50 is an exceptional performance, low thermal resistance thermal gap pad, it is conformable to component topography improving thermal contact and maxmizing heat transfer. GLPOLY has a complete portfolio of thermal interface materials, applying to new energy electric vehicle (battery pack, motor control unit, electronics control unit), consumer electroncis, security, medical equipment, military equipment and more. GLPOLY has partnered with Han’s Laser, dJI, CATL, GAC NE, NIO Automotive etc., delivering advanced technological thermal management solutions. GLPOLY thermal interface materials provides superior quality and design flexibility.

Minimum Order: 10 long tons

non-dry out, non-curing non-silicone thermal gel, maybe no one else can provide except GLPOLY. In the last several years, few of thermal management engineers would intergrate “non-silicone” thermal interface materials in their application due to less referentical cases, silicone based thermal interface materials were priority. GLPOLY was the first thermal interface materials manufacturer that provided diversified thermal management materials including non-silicone materials in China. Non-silicone thermal gel, for instance, there were few choices for customers at present, some suppliers provided y grease instead of non-silicone thermal gel, socking customers’ interests. One customer wanted to intergrat paste material in camera, siloxane volatiles were not allowed due to concerns of optic component atomization. Also customer requested that thermal gel should be non-dry out, non-curing. Taking all the factors, non-silicone thermal gel would be the best solution. They consulted with many suppliers, but they just collected two samples finally because there was just a few choices on non-silicone thermal gel in the market. GLPOLY XK-GN30 was the third one they selected. All samples would be verified for silicone free and high temperature aging test. Three non-silicone thermal gel were approved by siliocne free test. But huge variations was showed up in the high temperature test at 105C for 1000 hours. The temperature of the devices which competing products applied was out of expectation, when they took apart components, they found the non-silicone thermal gel was dry out. Only the one with GLPOLY XK-GN30 applied performed stable. As our discussion and analysis, the competing products were thermal grease, it would dry out under high temperature. In the next month when we attended a fair, we invited customer to visit out booth and leared more about XK-GN30 non-silicone thermal gel, and finally we established business relationship. GLPOLY non-silicone thermal gel is a high performance gap filling material, designed to eliminate siloxane concerns for precise or optic component intergrated devices. This material is compatible with automated dispense process, accommodating a variety of gap thickness. GLPOLY thermal interface materials has been applying to cosumer electronics, military equipment, medical equipment, drone, automotive electronics and EV battery pack, serving top class customers like LG, dJI, GAC NE, NIO Automotive, DT Mobile and more. GLPOLY thermal interface materials provides considerate service for you.

Minimum Order: 10 long tons

GLPOLY thermal gap pad XK-P60-PUTTY is an analogue that can substitute for Laird Tflex HD700 with high thermal performance and high compression. You will find that a lot of suppliers said they can provide substitute for Laird Tflex HD700 because our product provides the same thermal conductivity. Is it true? When you review the datasheet or you know even just a little about thermal gap pad, you can find that thermal conductivity is not the most important, it does not meam thermal cnductivity is not vital, but compared to the products which is with similar thermal performance, Laird Tflex HD700 provides higher compression and conformability. With benchmark of Tflex HD700, GLPOLY released XK-P60-PUTTY with high performance and compression as a perfect substitute for Tflex HD700. A customer searched us from internet and asked “can you really provide a perfect alternative part to Laird Tflex HD700 or just provide a similar product”. “Perfect alternative with thermal and physical properties, test result will show you what it really is”. We provided a XK-P60-PUTTY in 1.5mm thick after customer gave me application information of power and gap size. The test last for two weeks, customer was satisfied with result when test was finished. Customer told me that they bought a Laird Tflex HD700 from electronic material supplier on internet while he took samples from me for comparing. The temperature is 65 degree when performing with Tflex HD700, it was good, but GLPOLY thermal gap pad was better, the temperature was maintained under 60 degree. The chief engineer sent me a message, just one word ”excellent”. GLPOLY thermal gap pad XK-P60-PUTTY is high performance, high compression gap filling material with thermal conductivity of 6.0W/mK. It provides high deflection under low compressive forces, decreasing stress on component and avoiding component failures. GLPOLY is qualified partner to Huawei, ZTE and DJI, also GLPOLY thermal materials have been applied in new energy electric vehicle. GLPOLY is committed to delivering advanced thermal management solutions for top class clients.

Minimum Order: 10 long tons

More and more customers wanted to find local suppliers of thermal interface materials to replace foreign suppliers due to the trade war, the supply chain had been affected by US trade embargo. But to be honest, it was not easy to find superior alternates to top-class foreign brands. In such a situation, GLPOLY had emerged as a top rank supplier of thermal interface materials after 12 consecutive years of R&D and manufacturing investment. GLPOLY thermal interface materials has been applying to military equipment and new energy electric vehicle (EV) sector. This military customer used to apply Laird Tflex 700 to their equipment, but now how comes this military customer selected GLPOLY XK-P50 thermal gap pad from a dozen of suppliers? Except the trade emcargo, XK-P50 thermal pad provided advantages that competitive products could not supercede: 1) thermal conductivity 5.0W/mK benchmarked Laird Tflex 700; 2) compression rate 30%, competitive products could not achieved; 3) Prove reliability under extreme temperature cycling. When this customer consulted with me about thermal gap pad that could replace Laird Tflex 700. It’s a 5.0W/mK thermal gap pad, I could find an alternate easily from GLPOLY product portfolio. After well communication, I recommended XK-P50, along with full set of files including type inspection report, competitive products comparison, third party reliability verification, enterprise standard of thermal gap pad and study report of reliability of long-term service etc. When customer received these files, he was surprised, because we were the first supplier that provided a full set of verification paper. When higg temperature aging test for 1000hrs and thermal shock for 500 cycling were finished, customer told me that he was saitisfied with the performance, also the price was 30% lower than Laird Tflex 700’s, XK-P50 was introduced into supplier system instead of Tflex 700. GLPOLY XK-P50 is a high performance thermal gap pad with a thermal conductivity of 5.0W/mK. This material was conformable to component topography, decreasing contact thermal resistance. GLPOLY thermal interface materials have been applying consumer electronics, medical and military equipment, 5G telecom equipment, automotive electronics, electrical vehicle (EV) battery pack and more. GLPOLY thermal interface materials stick to core, GLPOLY provides considerate service for you.

Minimum Order: 10 long tons

GLPOLY XK-G40 Thermal Putty Applying To Radar Thermal Management of Auto Pilot Instead of Laird Tputty 508. XK-G40 Thermal putty had been launched for years but few of engineers wanted to use it because comparing with traditional paste materials, it was a new material. but now, it’s getting more and more attraction from engineers. Taking Laird Tputty 508 as benchmark, GLPOLY XK-G40 thermal putty provides a thermal conductivity of 4.0W/mK, compatible with high volume, automated dispense process. A vehicle controller manufacturer contacted me and inquired about thermal putty which could replace Laird Tflex 508. He used to apply this material in bulk production. In order to low the cost down and decrease purchasing complexity, this customer wanted to find a local supplier instead of Laird. I met many cases like this looking for alternates. XK-G40 was preferred, providing exceptional thermal performance. This material was verified by third party, tested items including high temperature aging test, high and low temperature thermal shock and 85°C&RH85% test and vibration test. Customer reviewed the reports and said:”it’s great, realibility is the most important to us, I will let our engineer verify it in assembly.” Two months later, customer contacted me, said:”performance of thermal gel XK-G40 is great, satisfying our design requirements, it could be alternative to Tputty 508. How about the price, as expensive as Tputty 508? ” I told him that GLPOLY thermal interface materials provided equivalent performance to world-class competitive products, but the price of XK-G40 is 30% lower than that of them. GLPOLY was introduced into customer’s BOM and applied in bulk production. GLPOLY thermal putty XK-G40 is ideal for high performance electronic devices, it will wet out interface, decreasing contact thermal resistance, improving heat transfer. This material deflects under low compressive forces, decreasing stress on component thun decreasing component failure. GLPOLY has been engaged in thermal interface materials sector for 12 years, providing technological advanced thermal solution and superior service, keeping your devices run cooler and more stably.

Minimum Order: 10 long tons

It sounds easy and simple to make thermally conductive insulator, but there are just two or three high quality thermal insulator manufacturers in China, GLPOLY is one of them. For many thermal management engineer, Bergquist thermally conductive insulator is preferred, or take it as benchmark even they don’t use it finally. The main raw materials are fiberglass(or PI), silicone oil and thermally conductive powder. it is very simple, isn’t it? but few of manfacturers can make quality thermal insulator with high performance and reliability. There are always some problems, either the low thermal performance or dielectric strength. We are not undervaluing peers, I have experienced that some peers bought thermally conductive insulator from us. GLPOLY is one of the leading expert in the development and production of thermal insulator, taking Bergquist etc as benchmark. A motorized chair mannufacturer consulted us about thermally conductive insulator. They wanted to use a local alternative product to replace Bergquist Sil-Pad 900S, requesting an equivalent of performance or better. The customer had tested many similar samples before and failed each of them, because the temperature rise of chip is 95 degree, exceeding design requirement. Customer is misguided in expecting an higher thermal conductivity. We recommended a thermal insulator XK-F20ST1 with 2.3W/mK, but customer doubted whether the thermal conductivit is high enough, “the thermal conductivity of samples we had tested before were 2.0W/mK, is 2.3W/mK enough?“. Actually, in order to enhance dielectric strength, some suppliers use materials which is detremtal to heat transfer and customer doesn’t know detail. We suggest customer test it first, “the cost high performance thermal matieral is proportional to thermal conductivity, we must consider the necessary of using a higher performance thermal material. If it is unworkable, we’ll provide another high performance product”. Customer accepted our suggestion and tested the 2.3W/mK thermally conductive insulator. Finally, customer was surprised by result, during the entire testing process, the temperature never exceeded 80 degree. Compared with Bergquist Sil-Pad 900S, GLPOLY XK-F20ST1 thermally conductive insulator provided high thermal performance as Sil-Pad 900S does, at the meantime, with a favorable price and shorter lead time. GLPOLY XK-F20ST1 is a high performance, electrical insulation thermally conductive insulator with low thermal impedance 0.22℃in2/W. It has a dielectric voltage of 3.5kV, providing excellent reliability. XK-F20ST1 thermal insulator is one or two sided soft-tack for ease of assembly. The soft natura makes interface contact more fully, optimizing heat transfer. GLPOLY has been providing thermal insulator for DJI and Han’s Laser etc top-class enterprises for several years. GLPOLY help keep you design beakthroughs with complete portfolio of thermal management materials.

Minimum Order: 10 long tons

GLPOLY thermal interface materials are recognized thermal management products, backing by state-of-the-art R&D resource and quality service. GLPOLY thermal management solutions provides reliable, high performance in multipe markets and applications including automtive, consumer electronics, industrial devices, telecom, communication and more. GLPOLY provides complete portfolio of thermal management materials protecting your devices and brand reputation. 1. Thermal gap pad. Soft thermal pad is recommended for applications that require a minimum amount of pressure on components. It is high conformable, low modulus and two sided self tack for reducing contact thermal resistance. 2. Thermal gap filler. Two-part dispensable thermal gap filler and one-part thermal gel are included. They has a ultra thin bondline and feature high performance, low thermal impedance, suitable for automated dispensing system, saving cost and improving productivity. 3. Silicone-free thermal materials. Silicone-free thermal gap filler and silicone-free thermal pad are suitable for silicone-sensitive applications which has optical windows avoding siloxane volatiles. 4. Other thermal solutions include thermally conductive tapes, thermally conductive adhesives, epoxy, thermal grease, hybrid thermal&EMI absorber and more. No matter your industry, GLPOLY thermal management materials can help you design devices that run cooler and more reliably. The excellent thermal conductivity, high dielectric strength and conformability make them ideal for electronics and its related products.

Minimum Order: 10 long tons

I received a lot of consultation about Bergquist Hi-Flow 300P from thermal management engineers, “Can you offer it or the alternatives”. Bergquist Hi-Flow 300P are highly reliable, no matter the thermal performance, or electrical properties. We can find many phase change materials too, but the problem is that most of PCM lack of electrical insulation.GLPOLY is the only one released a phase change of XK-C16 with excellent thermal performance and electrical insulation in China. One customer applied a Bergquist Hi-Flow 300P phase change materials to power supply, now they wanted to use a local PCM replacing Bergquist Hi-Flow 300P because of pressure of high cost. But they had tested many local products and found that all samples were unqualified. Power supply applications require excellent thermal performance and electrical insulation at the same time. GLPOLY is practical and realistic about performance of PCM, all parameters are consistent with performance, of course, test result will be the best proof. The end products will be sold in US, there is strict regulations there about electronic products, test must be rigorous too. Testing lasted for six months and test results satisfied customer’s requirement. Both GLPOLY XK-C16 PCM and Bergquist Hi-Flow 300P has a thermal conductivity of 1.6W/mK, but XK-C16 provided a much lower thermal impedance of 0.23℃in2/W, it was two thirds of that of Bergquist Hi-Flow 300P, more important is XK-C16 phase change material offered excellent electrical properties for a withstand voltage of 3.5kV. GLPOLY XK-C16 was the only one that met customer’s application requirement. GLPOLY XK-C16 is a kapton reinforced, high performance, electrical insulation phase change material. When temperature rises beyond phase change temperature, it will soften or liquify and fill intricate voids and gaps fully. When temperature decreases, the liquid material will form into sheet for ease of maintenance. If you can not find appropriate thermal management material , please come to GLPOLY, GLPOLY will design a pioneer and efficient thermal management solution for you to help you design breakthroughs.

Minimum Order: 10 long tons