Offers to Sell

AlSiC Pin Fin Coolers for IGBT Features AlSiC Pin Fin Coolers for IGBT: We offer high-performance AlSiC coolers designed for efficient heat management. Function: Provides superior thermal dissipation for IGBT modules, ensuring stable operation and enhanced reliability. Applications: Used in power electronics and automotive systems, addressing high-heat challenges in IGBT cooling. Sizes: Available in various dimensions to fit different IGBT configurations. Target Customers: Electronics manufacturers, automotive suppliers, and industries requiring advanced cooling solutions for power modules.

Minimum Order: 10 long tons

AlSiC Pin Fin Coolers for IGBT Features AlSiC Pin Fin Coolers for IGBT: We offer high-performance AlSiC coolers designed for efficient heat management. Function: Provides superior thermal dissipation for IGBT modules, ensuring stable operation and enhanced reliability. Applications: Used in power electronics and automotive systems, addressing high-heat challenges in IGBT cooling. Sizes: Available in various dimensions to fit different IGBT configurations. Target Customers: Electronics manufacturers, automotive suppliers, and industries requiring advanced cooling solutions for power modules.

Minimum Order: 10 long tons

AlSiC Pin Fin Coolers for IGBT Features AlSiC Pin Fin Coolers for IGBT: We offer high-performance AlSiC coolers designed for efficient heat management. Function: Provides superior thermal dissipation for IGBT modules, ensuring stable operation and enhanced reliability. Applications: Used in power electronics and automotive systems, addressing high-heat challenges in IGBT cooling. Sizes: Available in various dimensions to fit different IGBT configurations. Target Customers: Electronics manufacturers, automotive suppliers, and industries requiring advanced cooling solutions for power modules.

Minimum Order: 10 long tons

Liquid Cooling Plates for Optimal Temperature Control in Gaming PCs MOS liquid cooling plate The unique heat dissipation design cleverly directs the water cooling liquid to the CPU, GPU, and artificial intelligence chips.Achieve excellent cooling and heat dissipation performance. Its unique flow path design ensures that the coolant can flow efficiently.Evenly distributed on each heat dissipation surface, thereby significantly improving heat dissipation efficiency. Compared with traditional heat dissipation methods.Heat sinks and fans enhance heat dissipation more effectively. Small batch customization with quick proofing 》Efficient heat dissipation and noise control. 》Higher performance and extended graphics card life. 》Compatible with, and manufactured from highly thermally conductive materials such as copper and aluminum. 》Easy to install. 》Seamless and perfect joint, no worries about leakage. Model ：T-HS202314 Category：High power MOS Welding process：Aluminum alloy Vacuum brazing heat source Total power：2500W Working environment：55°C，6.5LPM，56%EGW cold plate surface temperature： below65°C flow resistance：Below12KPa Resistant to stress：1Mpa

Minimum Order: 10 long tons

Cost-Effective Liquid Cooling Plate Solutions for Electronic Devices IGBT liquid cooling plate The unique heat dissipation design cleverly directs the water cooling liquid to the CPU, GPU, and artificial intelligence chips.Achieve excellent cooling and heat dissipation performance. Its unique flow path design ensures that the coolant can flow efficiently.Evenly distributed on each heat dissipation surface, thereby significantly improving heat dissipation efficiency. Compared with traditional heat dissipation methods.Heat sinks and fans enhance heat dissipation more effectively. Small batch customization with quick proofing 》Efficient heat dissipation and noise control. 》Higher performance and extended graphics card life. 》Compatible with, and manufactured from highly thermally conductive materials such as copper and aluminum. 》Easy to install. 》Seamless and perfect joint, no worries about leakage. Model ：T-HS202313 Category：High power IGBT Welding process：Aluminum alloy Vacuum brazing heat source Total power：10KW Working environment：38°C, 20LPM, 纯水 cold plate surface temperature：below56°C flow resistance：Below50KPa Resistant to stress：1Mpa

Minimum Order: 10 long tons

Choosing the Best Liquid Cooling Plate for Your High-Performance CPU NVIDIA GPU 3080 double-wide liquid cooling plate The unique heat dissipation design cleverly directs the water cooling liquid to the CPU, GPU, and artificial intelligence chips.Achieve excellent cooling and heat dissipation performance. Its unique flow path design ensures that the coolant can flow efficiently.Evenly distributed on each heat dissipation surface, thereby significantly improving heat dissipation efficiency. Compared with traditional heat dissipation methods.Heat sinks and fans enhance heat dissipation more effectively. Small batch customization with quick proofing 》Efficient heat dissipation and noise control. 》Higher performance and extended graphics card life. 》Compatible with, and manufactured from highly thermally conductive materials such as copper and aluminum. 》Easy to install. 》Seamless and perfect joint, no worries about leakage. Model ：T-HS202312 Category：NVIDIA GPU Welding process：pure copper TLP welding heat source Total power：368 Working environment：40°C,5LPM,纯水 cold plate surface temperature：below52°C flow resistance：Below9KPa Resistant to stress：1Mpa

Minimum Order: 10 long tons

How Liquid Cooling Plates Improve Cooling Efficiency in Servers NVIDIA GPU 3090 double-wide liquid cooling plate The unique heat dissipation design cleverly directs the water cooling liquid to the CPU, GPU, and artificial intelligence chips.Achieve excellent cooling and heat dissipation performance. Its unique flow path design ensures that the coolant can flow efficiently.Evenly distributed on each heat dissipation surface, thereby significantly improving heat dissipation efficiency. Compared with traditional heat dissipation methods.Heat sinks and fans enhance heat dissipation more effectively. Small batch customization with quick proofing 》Efficient heat dissipation and noise control. 》Higher performance and extended graphics card life. 》Compatible with, and manufactured from highly thermally conductive materials such as copper and aluminum. 》Easy to install. 》Seamless and perfect joint, no worries about leakage. Model ：T-HS202311 Category：NVIDIA GPU Welding process：pure copper TLP welding heat source Total power：350 Working environment：50°C,1LPM,30%EGW cold plate surface temperature：below61°C flow resistance：Below5KPa Resistant to stress：1Mpa

Minimum Order: 10 long tons

Comparing Liquid Cooling Plates and Air Coolers for Electronic Systems Intel Eagle-stream liquid cooling plate 350W×2 The unique heat dissipation design cleverly directs the water cooling liquid to the CPU, GPU, and artificial intelligence chips.Achieve excellent cooling and heat dissipation performance. Its unique flow path design ensures that the coolant can flow efficiently.Evenly distributed on each heat dissipation surface, thereby significantly improving heat dissipation efficiency. Compared with traditional heat dissipation methods.Heat sinks and fans enhance heat dissipation more effectively. Small batch customization with quick proofing 》Efficient heat dissipation and noise control. 》Thermal design optimization, structural design. 》Apply solder and heat and solder. 》Drilling, welding, surface treatment and other processes. 》Seamless and perfect joint, no worries about leakage. Model ：T-HS202310 Category：Intel CPU Welding process：pure copper TLP welding heat source Total power：350W×2 Working environment：40°C,1.2LPM,25%EGW cold plate surface temperature： below52°C flow resistance：Below16KPa Resistant to stress：1Mpa

Minimum Order: 10 long tons

Custom Liquid Cooling Plates for Optimizing Heat Transfer in Electronics Intel Eagle-stream liquid cooling plate 700W×2 The unique heat dissipation design cleverly directs the water cooling liquid to the CPU, GPU, and artificial intelligence chips.Achieve excellent cooling and heat dissipation performance. Its unique flow path design ensures that the coolant can flow efficiently.Evenly distributed on each heat dissipation surface, thereby significantly improving heat dissipation efficiency. Compared with traditional heat dissipation methods.Heat sinks and fans enhance heat dissipation more effectively. Small batch customization with quick proofing 》Efficient heat dissipation and noise control. 》Thermal design optimization, structural design. 》Apply solder and heat and solder. 》Drilling, welding, surface treatment and other processes. 》Seamless and perfect joint, no worries about leakage. Model ：T-HS202309 Category：Intel CPU Welding process：pure copper TLP welding heat source Total power：700W×2 Working environment：40°C,1.1LPM,25%EGW cold plate surface temperature： below64°C flow resistance：Below16KPa Resistant to stress：1Mpa

Minimum Order: 10 long tons

Liquid Cooling Plates for Efficient Heat Dissipation in Industrial Equipment NVIDIA GPU H800 single-width liquid cooling plate The unique heat dissipation design cleverly directs the water cooling liquid to the CPU, GPU, and artificial intelligence chips.Achieve excellent cooling and heat dissipation performance. Its unique flow path design ensures that the coolant can flow efficiently.Evenly distributed on each heat dissipation surface, thereby significantly improving heat dissipation efficiency. Compared with traditional heat dissipation methods.Heat sinks and fans enhance heat dissipation more effectively. Small batch customization with quick proofing 》Efficient heat dissipation, energy saving, environmental protection, and space utilization. 》Enhance system reliability and reduce noise. 》TLP welding, no pollution to the environment. 》Heat recovery, internal installation. 》Seamless and perfect joint, no worries about leakage. Model ：T-HS202308 Category：NVIDIA GPU Welding process：pure copper TLP welding heat source Total power：350W Working environment：45°C，0.9LPM，40%EGW cold plate surface temperature： below56°C flow resistance：Below5KPa Resistant to stress：1Mpa

Minimum Order: 10 long tons

I. Specification Model TD703AD 1 Worktable Dimension 550×360㎜ 2 Travels X×Y×Z 350×250×（380+300）㎜ 3 Max Load on Work Table 350kg 4 Max Pressure of Working Water 14Mpa 5 Flume dimension 800*450mm 6 Max Work Current 30A 7 Electrode Diameter Ф0.15-Ф3mm 8 Max Process Deep 400mm 9 Max Processing Speed 30-60mm(Ф1.0) 10 Max Diameter to Deep Ratio ≥300 11 Workpiece Material Steel/Aluminum/Copper/Carbide and Various of Conductors 12 Working Medium Tap water/Ion free water 13 Machine Exernal Dimensions 1000×750×2000mm 14 Machine Weight 950kg II. The machine characteristics: 1. Process deep holes of diameter from Ф0.15-Ф3mm rapidly 2. Servo control system realizes speedy motion. 3. High accuracy movement by linear roller guides of Z axis. 4. X,Y,Z three axes adopt high accuracy ball screws for fast and agile movement. 5. X,Y axes base high precision V-shape and Flat rails with Teflon protection for high stiffness and wide travel. 6. Three axes DRO with linear scales, auto depth control helps blind holes process. 7. Water and dust proved panel in touching . 8. Smart Drill interface and digital frequency generator. 9. Special pump made in Taiwan. 10. Max process depth ≥400mm. 11. One touch, one hole made. 12. Rotating device sealed in plane structure by anti-rust material. (The main difference between TD703A and TD703AD is the operation panel. ON TD703AD, it is stainless steel panel, having a longer usage life).

Minimum Order: 2 barrels

Designing Effective Liquid Cooling Plates for High-Temperature Applications NVIDIA GPU 4090 single-width liquid cooling plate The unique heat dissipation design cleverly directs the water cooling liquid to the CPU, GPU, and artificial intelligence chips.Achieve excellent cooling and heat dissipation performance. Its unique flow path design ensures that the coolant can flow efficiently.Evenly distributed on each heat dissipation surface, thereby significantly improving heat dissipation efficiency. Compared with traditional heat dissipation methods.Heat sinks and fans enhance heat dissipation more effectively. Small batch customization with quick proofing 》Efficient heat dissipation, energy saving and environmental protection. 》Single width design, fluid media. 》Space utilization, reliability. 》Using heat pipe technology and sealing materials. 》Seamless and perfect joint, no worries about leakage. Model ：T-HS202307 Category：NVIDIA GPU Welding process：pure copper TLP welding heat source Total power：450W Working environment：48°C，1LPM，20%PGW cold plate surface temperature： below65°C flow resistance：Below5KPa Resistant to stress：1Mpa

Minimum Order: 10 long tons

Name: Filter Item No.: T-W-F Specification: Outer diameter: 150mm Inner diameter: 33mm Height:375mm Package: 6 pcs per carton Usage: for the coolant tank of the Mo wire cut EDM machines

Minimum Order: 200

Advanced Liquid Cooling Plate Solutions for High-Thermal-Load Environments NVIDIA GPU A6000 single-width liquid cooling plate The unique heat dissipation design cleverly directs the water cooling liquid to the CPU, GPU, and artificial intelligence chips.Achieve excellent cooling and heat dissipation performance. Its unique flow path design ensures that the coolant can flow efficiently.Evenly distributed on each heat dissipation surface, thereby significantly improving heat dissipation efficiency. Compared with traditional heat dissipation methods.Heat sinks and fans enhance heat dissipation more effectively. Small batch customization with quick proofing 》Efficient heat dissipation, coolant flow rate, and space utilization. 》Heat dissipation structure design and circulation system design. 》Drilling, welding, surface treatment and other processes. 》Using heat pipe technology and sealing materials. 》Can be customized according to customer conditions. Model ：T-HS202306 Category：NVIDIA GPU Welding process：pure copper TLP welding heat source Total power：300W Working environment：50°C,1LPM,34%EGW cold plate surface temperature：below62°C flow resistance：Below2.5KPa Resistant to stress：1Mpa

Minimum Order: 10 long tons