Electronics & Electrical

XQJ-C type of channel-type cable is fully sealed. It is suitable for Laying computer cable, Communication cable, thermo-coupel cable and control cable with other sensitive system.It has a good effect on the screen interference of control cable and the protection of cable in heavy corrosion envionment. Model A×B   Specification kg Weight Weight C-1A-1 50×25 4.81 2.12 C-1A-2 100×50 8.81 4 C-1A-3 150×75 12.82 5.8 C-1A-4 200×100 22.98 8.05 C-1A-5 250×125 28.92 9.3 C-1A-6 300×150 41.58 13.53 C-1A-7 400×200 69.85 21.89 C-1A-8 500×200 80.41 26.84 C-1A-9 600×200 86.10 38.17 C-1A-10 800×200 101.71 58.15

The 18650 battery cell is one of the most mature and stable products of MATELION. It is applied in the field of E-bikes and electric tools etc.  With the most advanced technology and fully-automatic production line we realized the combination of security, consistency, long life and low cost, is now staying in the forefront of the industry. Standardization and compatibility are fully achieved, reducing costs and increasing efficiency. The standard size of 18mm × 65mm is globally applicable, compatible with mature PACK production lines and automated assembly, and can be mass-produced without equipment modification. The group efficiency is high and consistency is strong. It is compatible with the full series of protection boards and structural components of 18650, and the procurement and replacement costs are low.It supports free combination of series / parallel, and can quickly build voltage platforms of 12V/24V/48V, suitable for various demands from small devices to energy storage systems. When replacing nickel cadmium / nickel hydrogen batteries, the original box design can be directly reused, shortening the product development cycle.

21700 Battery Cells are advanced cylindrical rechargeable lithium batteries designed to deliver higher energy density, longer runtime, and improved thermal performance compared with traditional formats. With a diameter of 21mm and length of 70mm, 21700 cells strike an optimal balance between capacity, power output, and safety, making them one of the most popular choices for modern industrial, commercial, and energy storage applications. Core Competitive Advantages 1. Capacity and density both increase, reducing assembly costs Single-cell capacity 3000-5000mAh, approximately 30%-50% higher than 18650, with the same system reducing the number of cells by 20%-30% and simplifying the PACK design, lowering BMS and structural component costs.Energy density 180-260Wh/kg, supporting 2C-11C fast charging and high-current discharge. The lithium-ion system can sustain discharge at 25-50A, and the lithium iron phosphate has a cycle life of ≥3000 times (80% DOD). The terminal replacement frequency is significantly reduced.

26650 Battery Cells are large-format cylindrical rechargeable lithium batteries designed for high power output, long cycle life, and excellent thermal stability. With a diameter of 26mm and length of 65mm, 26650 cells provide significantly higher capacity and discharge performance compared with smaller cylindrical formats, making them ideal for demanding industrial and commercial energy systems. As a professional Industrial Rechargeable Batteries Cells manufacturer, we offer reliable lithium battery solutions widely used in energy storage, electric mobility, industrial equipment, and backup power applications. Core Competitive Advantages 1. Size and Integration Advantage, Compatible with Mainstream Solutions Standard cylindrical size (26×65mm), compatible with 18650 mature production lines and PACK processes, can be directly replaced and upgraded, reducing equipment renovation costs; supports series/parallel combinations, suitable for diverse demands ranging from small devices to energy storage systems.The structure is sturdy, with steel shell packaging that is resistant to impact and vibration, suitable for outdoor and industrial environments, and easier for automated assembly than pouch cells, with a production efficiency increase of 20%+ and stronger batch consistency.

LiFePO4 Pouch Cells are advanced lithium iron phosphate battery cells designed for applications that require high safety, long cycle life, and stable performance. Compared with traditional lithium-ion batteries, LiFePO4 chemistry offers superior thermal stability, excellent structural integrity, and outstanding reliability, making it one of the most trusted battery technologies in industrial and commercial energy systems. As a professional Pouch Cells manufacturer, we provide high-quality lithium battery cells that are widely used in energy storage systems, electric vehicles, backup power solutions, and industrial equipment.

The super cell is the 280Ah LFP prismatic cell which is designed with unique structure of one-tab, that the taps stand out of the two ends of the cell.  Because the entire empty foil area is full of tabs, it can withstand larger current and the cell C-rate performance is very good. Besides,the temperature rise is obviously lower than common LFP primatic cells . LFP Prismatic Cells are lithium iron phosphate battery cells designed with rigid aluminum or steel casing, offering exceptional safety, structural stability, and long-term reliability. LFP (LiFePO4) chemistry is widely recognized as one of the safest lithium battery technologies, making prismatic LFP cells the preferred choice for large-scale energy storage systems, electric vehicles, and industrial power applications.

Mainly used in the semiconductor packaging industry, it can be used for various types of integrated packaging. Automatic Press-Fit Machine — Precision, Speed, Reliability Upgrade your production line with our Automatic Press-Fit Machine — engineered for repeatable, high-throughput press-fit insertion with industry-grade precision. Built for electronics and connector assembly where consistent force control, part integrity, and uptime matter, our Press Fit Machine combines servo-driven motion, integrated process monitoring, and flexible tooling to deliver fast cycle times and near-zero defect rates. Our Automatic Press-Fit Machine performs controlled press-fit insertions and swaging operations with programmable force profiles, automatic head/tool changes, and optional vision alignment — ensuring every connector or component is seated correctly without board damage. It’s designed for both inline SMT/PCB lines and stand-alone automation cells. Key features ·  Servo-controlled press with force-profile management for repeatable, measurable insertions and automatic reject on out-of-spec events. ·  High-precision positioning & optional vision guidance to align pins/connectors before press-fit, reducing cycle rework. ·  Multi-head / multi-station configurations available for high throughput (parallel insertion) or flexible one-off setups. ·  Smart process monitoring & data logging (SPC) — force/position traceability for quality control and process optimization. ·  Modular tooling and quick-change fixtures so the machine adapts fast to new connector types and board layouts. ·  User-friendly touchscreen HMI and PLC control with recipe management for fast line changeovers. Benefits for your factory ·  Reduce defects & rework — precise force control and vision alignment protect expensive PCBs and components. ·  Increase throughput — configurable multi-head systems and fast cycle recipes maximize production yield. ·  Improve traceability & compliance — built-in logging and reject handling make audits and quality reporting simple. ·  Lower total cost of ownership — robust design, easy maintenance, and modular upgrades keep downtime low. About us: https://www.topleadingintel.com/aboutus/

Mainly used in the semiconductor packaging industry, it can be used for various types of integrated packaging. Tri-Temperature Test Handler — Precision Thermal Test Our Tri-Temperature Test Handler delivers reliable, repeatable thermal testing across the full tri-temp spectrum so you can validate device performance where it matters most — from extreme cold to high heat. Designed for engineering labs and scalable to production lines, this handler combines precise thermal control, high throughput multi-site testing, and broad device compatibility to shorten time-to-market and reduce test costs. Benefits of Tri-Temperature Handler ·  Wide, industry-grade temperature range for true tri-temp testing (cold → ambient → hot), supporting the full range of device characterization and qualification needs. ·  Active thermal control (ATC) and multi-zone temperature management keep DUT temperatures stable and uniform during high-power or long soak tests, improving data quality and yield. ·  Multi-site parallel testing and optimized handling mechanics deliver high units-per-hour throughput while minimizing jams and socket wear — ideal for semiconductor production and high-volume validation. ·  Flexible cooling/heating architectures (LN₂ or modern refrigerant thermal engines) let you match performance to cost and facility constraints. ·  Engineered to support a wide array of package types (QFN, BGA, QFP, TO- packages, SOT23, etc.) and easy kit changeover for fast product mix-shifts. Technical Highlights ·  Full tri-temp capability with precision thermal control for accurate soak and transition cycles. ·  Configurable parallelism (single-site up to multi-site arrays) so you can prioritize throughput or per-device characterization as required. ·  Industry-proven sockets, thermal engines, and pre-heat designs that integrate seamlessly with ATE test heads and common production workflows. ·  Robust mechanical design for long MTBF and easy maintenance — reduces downtime and total cost of ownership. About us: https://www.topleadingintel.com/aboutus/

Mainly used in the semiconductor packaging industry, it can be used for various types of integrated packaging. A final test handler is an automated system used for the final testing of semiconductor devices. It performs critical functions such as device transport, temperature control during testing, and sorting of units based on test results. Through advanced semiconductor testing systems, manufacturers can identify non- compliant devices early, optimize overall production yield, and minimize the risk of failures in critical applications. Advanced Final Test Handling System Modern semiconductor applications demand high-precision, innovative technology — including automated optical inspection (AOI), tri-temperature testing, IC testing, and sensor testing. These processes require reliable, repeatable, and clean test floor environments to ensure the highest levels of quality control and product assurance. As a full-service systems integrator, Top-leading provides comprehensive semiconductor solutions — from Automatic Test Equipment (ATE) to fully Automated Handling Systems. Our expertise covers the design, manufacturing, and service of state-of-the-art device handling solutions — from basic sub-systems to turnkey automation platforms. Flexible and Scalable Final Test Handler Solutions Top-leading's innovative and user-friendly handling systems can be configured as basic, kitless test handlers or expanded into advanced test handling systems through a wide range of optional modules. This flexibility allows users to meet diverse testing requirements efficiently — from R&D environments to high- volume production. Our Test Handler platform covers a wide range of automated test and handling applications, from passive electronic components to semiconductor devices. In addition to standard test handlers for resistors and capacitors, our platform can be extended to semiconductor test handler solutions, including KGD (Known Good Die) handling and testing, supporting customized test flow, sorting logic and automation integration. About us: https://www.topleadingintel.com/aboutus/

Mainly used in the semiconductor packaging industry, it can be used for various types of integrated packaging. Automated Optical Inspection System — Accurate. Fast. Built for Production Deliver defect-free electronics with an advanced Automated Optical Inspection (AOI) System designed for inline production and offline lab use. Our AOI platform combines precision optics, flexible multi-angle lighting, and AI- assisted image analysis to catch soldering faults, component misplacements, missing parts, and surface defects at high speed — reducing escapes, rework, and warranty risk for OEMs and contract manufacturers. Why Choose Our AOI ·  Enterprise-grade accuracy: Custom-engineered ±1µm precision motion stages ensure repeatable, high-resolution imaging for the smallest components and materials. ·  AI + traditional dual-mode detection: Hybrid algorithms combine deterministic rule-based checks with machine learning models to lower false calls while improving detection of new or complex defect types. ·  True 2D/3D inspection and multi-angle imaging: Capture top and side profiles, height/3D features, and perform instant overlay and 3D analysis for tombstoning, solder-volume, and coplanarity checks. ·  Flexible deployment: Modular hardware and software support inline conveyor integration, standalone bench units, or integration with upstream/downstream processes such as barcode marking, laser marking, and robotic loading. ·  Fast programming and traceability: DXF one-click programming and automated recipe generation shorten setup time, while full barcode/lot traceability and reporting simplify process control and customer audits. Key Features: Engineered for Manufacturers ·  High-resolution optical heads with tunable RGB or structured lighting for contrast optimization. ·  Linear servo motor stages and vibration-damped marble platforms for micron-level stability. ·  AI-driven defect classification and automatic defect analysis for faster root-cause feedback. ·  Scalable throughput options: single-board inspection to high-speed inline systems for mass production. ·  Integration with dispensing and fluid-control systems for process verification and automation efficiency. Benefits ·  Reduce escapes and rework costs by identifying defects before assembly proceeds. ·  Shorten NPI cycles with rapid recipe creation and robust programming tools. ·  Improve yield and customer confidence with audit-ready traceability and actionable defect analytics. About us: https://www.topleadingintel.com/aboutus/

Mainly used in the semiconductor packaging industry, it can be used for various types of integrated packaging. Die Bonding Manufacturer - Top-leading In back-end semiconductor manufacturing, the die attach process is a critical step. Top-leading’s die attach equipment is based on unique and innovative concepts, offering economic benefits to customers. The Top-leading Die Bonder is a high-precision assembly system engineered for fully automated die attachment in large-scale production environments. Its modular architecture ensures outstanding process reliability, high throughput, and exceptional flexibility. What is a die bonder? The semiconductor chip manufacturing process is divided into two phases: front-end and back-end. The front-end processing phase involves projecting a circuit pattern onto the surface of a semiconductor wafer so that it is printed onto the wafer, while the back-end processing phase involves dicing the printed wafer into individual chips and assembling them into completed semiconductor devices. Automatic Die Bonder Top-leading's automatic die bonder platforms deliver high-precision solutions for semiconductor and microelectronic assembly. Engineered for superior accuracy, unmatched flexibility, and rapid setup, these systems are ideal for a wide range of applications — from research and development and prototyping to high-mix and volume production. Our die bonders support a broad variety of bonding techniques and component types, making them an excellent choice for advanced packaging and high- precision die attach processes, including: ·  Hi-Rel Devices: High-reliability assemblies for aerospace and industrial applications. ·  Medical Devices: Precision bonding for embedded or monitoring systems. ·  Semiconductor Packaging: Attaching IC dies to packages or substrates. ·  Optoelectronics: Assembly of laser diodes, LEDs, and optical modules. ·  MEMS & Sensors: Integration of microelectromechanical systems and sensor chips. ·  Power Electronics: Bonding high-power dies for automotive and industrial devices. ·  RF & Microwave Modules: Assembly of high-frequency components. Combining micron-level placement accuracy with high-speed operation and exceptional process flexibility, the equipment delivers both precision and performance. Standard features include multi-axis motion control (X, Y, Z, and Theta), vision alignment, and programmable bonding parameters. These capabilities ensure consistent and repeatable results across a wide range of die sizes and materials. About us: https://www.topleadingintel.com/aboutus/

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High Power 500W VHF Band 150-180MHz RF Coaxial Isolator for Radio Communication Systems. Features low insertion loss, high isolation, 50Ω impedance, rugged design, RoHS compliant & factory direct supply. Model number:5o00801401150180NK Frequency Range: 150~180MHz Insertion Loss: 0.6dB Isolation: 17dB VSWR:1.35 Forward Power:500W Reverse Power:250W Dimension:25*36*18mm

Minimum Order: 1 bags

UHF Band 350-370MHz Microwave Drop In Isolator-Low insertion loss (0.35dB), high isolation (21dB), 300W forward power, TAB package. Ideal for RF amplifier protection, communication systems & drone applications. Model number:5o0135460350370 Frequency Range:350~370MHz Insertion Loss:0.35dB Isolation:21dB VSWR:1.2 Forwa , rd Power:300W Reverse Power:150W Dimension:35*46*11mm Operating Temperature:-40~+85℃ Storage Temperature:-55℃~+125℃ Impedance:50Ω

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