Offers to Sell

Designing Effective Liquid Cooling Plates for High-Temperature Applications NVIDIA GPU 4090 single-width liquid cooling plate The unique heat dissipation design cleverly directs the water cooling liquid to the CPU, GPU, and artificial intelligence chips.Achieve excellent cooling and heat dissipation performance. Its unique flow path design ensures that the coolant can flow efficiently.Evenly distributed on each heat dissipation surface, thereby significantly improving heat dissipation efficiency. Compared with traditional heat dissipation methods.Heat sinks and fans enhance heat dissipation more effectively. Small batch customization with quick proofing 》Efficient heat dissipation, energy saving and environmental protection. 》Single width design, fluid media. 》Space utilization, reliability. 》Using heat pipe technology and sealing materials. 》Seamless and perfect joint, no worries about leakage. Model ：T-HS202307 Category：NVIDIA GPU Welding process：pure copper TLP welding heat source Total power：450W Working environment：48°C，1LPM，20%PGW cold plate surface temperature： below65°C flow resistance：Below5KPa Resistant to stress：1Mpa

Minimum Order: 10 long tons

Advanced Liquid Cooling Plate Solutions for High-Thermal-Load Environments NVIDIA GPU A6000 single-width liquid cooling plate The unique heat dissipation design cleverly directs the water cooling liquid to the CPU, GPU, and artificial intelligence chips.Achieve excellent cooling and heat dissipation performance. Its unique flow path design ensures that the coolant can flow efficiently.Evenly distributed on each heat dissipation surface, thereby significantly improving heat dissipation efficiency. Compared with traditional heat dissipation methods.Heat sinks and fans enhance heat dissipation more effectively. Small batch customization with quick proofing 》Efficient heat dissipation, coolant flow rate, and space utilization. 》Heat dissipation structure design and circulation system design. 》Drilling, welding, surface treatment and other processes. 》Using heat pipe technology and sealing materials. 》Can be customized according to customer conditions. Model ：T-HS202306 Category：NVIDIA GPU Welding process：pure copper TLP welding heat source Total power：300W Working environment：50°C,1LPM,34%EGW cold plate surface temperature：below62°C flow resistance：Below2.5KPa Resistant to stress：1Mpa

Minimum Order: 10 long tons

Top Benefits of Using Liquid Cooling Plates in Modern Computing NVIDIA GPU 4090 double-wide liquid cooling plate The unique heat dissipation design cleverly directs the water cooling liquid to the CPU, GPU, and artificial intelligence chips.Achieve excellent cooling and heat dissipation performance. Its unique flow path design ensures that the coolant can flow efficiently.Evenly distributed on each heat dissipation surface, thereby significantly improving heat dissipation efficiency. Compared with traditional heat dissipation methods.Heat sinks and fans enhance heat dissipation more effectively. Small batch customization with quick proofing 》Efficient heat dissipation, energy saving and environmental protection. 》Double wide design, fluid media. 》Space utilization, reliability. 》Drilling, welding, surface treatment and other processes. 》Can be customized according to customer conditions. Model ：T-HS202305 Category：NVIDIA GPU Welding process：pure copper TLP welding heat source Total power：450W Working environment：35°C，0.5LPM，34%EGW cold plate surface temperature： below55°C flow resistance：Below 8KPa Resistant to stress：1Mpa

Minimum Order: 10 long tons

How to Choose the Right Liquid Cooling Plate for Your Server GPU TTC-1000W/1200W/1500W liquid cooling plate The unique heat dissipation design cleverly directs the water cooling liquid to the CPU, GPU, and artificial intelligence chips.Achieve excellent cooling and heat dissipation performance. Its unique flow path design ensures that the coolant can flow efficiently.Evenly distributed on each heat dissipation surface, thereby significantly improving heat dissipation efficiency. Compared with traditional heat dissipation methods.Heat sinks and fans enhance heat dissipation more effectively. Small batch customization with quick proofing 》Efficient heat dissipation, energy saving and consumption reduction, and increased equipment density 》Enhance system reliability and reduce noise 》Friction welding, no pollution to the environment 》Flow channel processing, vacuum brazing, laser welding 》Can be customized according to customer conditions. Model ：TTC-1000 Category：GPU/Communication switch Welding process：pure copper TLP welding heat source Total power：1000W Working environment：30°C, 2LPM,pure water cold plate surface temperature：below 45°C flow resistance：Below 8KPa Resistant to stress：1Mpa Model ：TTC-1200 Category：GPU/Communication switch Welding process：pure copper TLP welding heat source Total power：1200W Working environment：30°C, 2LPM,pure water cold plate surface temperature：below 45°C flow resistance：Below 8KPa Resistant to stress：1Mpa Model ：TTC-1500 Category：GPU/Communication switch Welding process：pure copper TLP welding heat source Total power：1500W Working environment：30°C, 2LPM,pure water cold plate surface temperature：below 45°C flow resistance：Below 8KPa Resistant to stress：1Mpa

Minimum Order: 10 long tons

Efficient Liquid Cooling Plates for High-Power GPU Systems NVIDIA GPU A100/A800 single-width liquid cooling plate The unique heat dissipation design cleverly directs the water cooling liquid to the CPU, GPU, and artificial intelligence chips.Achieve excellent cooling and heat dissipation performance. Its unique flow path design ensures that the coolant can flow efficiently.Evenly distributed on each heat dissipation surface, thereby significantly improving heat dissipation efficiency. Compared with traditional heat dissipation methods.Heat sinks and fans enhance heat dissipation more effectively. Small batch customization with quick proofing 》One-piece molding, light weight, good performance。 》Special flow path design, uniform cooling surface 》Friction welding, no pollution to the environment 》Seamless and perfect joint, no worries about leakage 》Can be customized according to customer conditions. Model ：T-HS202303 Category：NVIDIA GPU Welding process：Aluminum alloy friction stir welding heat source Total power： 350W Working environment：50°C,1.5LPM,57%EGW cold plate surface temperature：below 55°C flow resistance：Below 9KPa Resistant to stress：1Mpa

Minimum Order: 10 long tons

Custom Liquid Cooling Plates for Advanced Electronic Applications Intel CPU X3 liquid cooling plate The unique heat dissipation design cleverly directs the water cooling liquid to the CPU, GPU, and artificial intelligence chips.Achieve excellent cooling and heat dissipation performance. Its unique flow path design ensures that the coolant can flow efficiently.Evenly distributed on each heat dissipation surface, thereby significantly improving heat dissipation efficiency. Compared with traditional heat dissipation methods.Heat sinks and fans enhance heat dissipation more effectively. Small batch customization with quick proofing 》Efficient heat dissipation, solid structure, and optimized thermal management. 》Performance is improved. After using the liquid cooling plate, the failure rate caused by CPU overheating is reduced by 50%. 》Runner processing, brazing packaging 》anodizing. 》Can be customized according to customer conditions. Model ：T-HS202302 Category：Intel CPU Welding process：pure copper TLP welding heat source Total power：270W Working environment：45°C,1LPM,45%PGW cold plate surface temperature：below 56°C flow resistance：Below 1.5KPa Resistant to stress：1Mpa

Minimum Order: 10 long tons

High-Performance Liquid Cooling Plates for Data Centers AMD CPU liquid cooling plate SP5 liquid cooling plate AMD CPU SP5 liquid cooling plate The unique heat dissipation design cleverly directs the water cooling liquid to the CPU, GPU, and artificial intelligence chips.Achieve excellent cooling and heat dissipation performance. Its unique flow path design ensures that the coolant can flow efficiently.Evenly distributed on each heat dissipation surface, thereby significantly improving heat dissipation efficiency. Compared with traditional heat dissipation methods.Heat sinks and fans enhance heat dissipation more effectively. Small batch customization with quick proofing 》High thermal conductivity material, precision processing. 》TLP welding, post-processing process. 》Efficient cooling performance, reliability and durability. 》Environmental protection and energy saving. 》Intelligent management, maintainability and flexibility. Model ：T-HS202301 Category：AMD CPU Welding process：pure copper TLP welding heat source Total power：500W Working environment：40°C,2LPM,25%EGW cold plate surface temperature：below 52°C flow resistance：Below 10KPa Resistant to stress：1Mpa

Minimum Order: 10 long tons

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The PMC-GBIT-DT2BP PMC610J4RC is a dual-channel Gigabit Ethernet interface module designed for real-time data transfer applications, especially in industrial automation systems. The module supports two independent Gigabit Ethernet ports, offering fast and reliable communication.

Minimum Order: 1 bags

Methane, the simplest organic matter, is widely distributed in nature and is the main component of natural gas, biogas, and pit gas. CAS NO 74-82-8 UN NO 1971 EINECS NO 200-812-7 Molecular weight 16.043 Appearance Colorless, Odorless Melting point -182.5 ℃ Boiling point -161.5 ℃ Density 0.717g/L DOT Class 2.1 Label Flammable Gas

Trifluoromethane is an organic compound, colorless, odorless, non-conductive gas, and the ideal halothane replacement. Trifluoromethane (CHF3) gas is an etching agent in semiconductor manufacturing, a refrigerant, and used in fire suppression systems. CAS No.  75-46-7 UN No.  1984 EINECS No.  200-872-4 Molecular weight  70.02 Appearance  colorless, odorless Melting point  -155 ℃ Boiling point  -84 ℃ Density  2.43kg/m3 DOT Class  2.2 Label  Non-flammable gas

Acetylene, commonly known as wind coal or calcium carbide, is the smallest of the alkynes and is a colorless, highly flammable gas at room temperature. Acetylene for industrial use contains impurities such as hydrogen sulfide and phosphine, and has a smell of garlic. CAS No.  74-86-2 UN No.  1001 EINECS No.  200-816-9 Molecular weight  26.04 Appearance  colorless and odorless (pure), smell of garlic (made of calcium carbide) Melting point  -81.8 ℃ Boiling point  -83.4 ℃ Density  0.62 kg/m³ DOT Class  2.1 Label  Flammable Gas

Boron trichloride (BCL3) is a colorless fuming liquid or gas. Non-flammable, irritating, acidic odor. Boron trichloride (BCl3) is a low vapor pressure gas. The molecule can be used in a wide range of applications, such as drying etching gases used for aluminum wiring in semiconductor and LCD manufacturing. Boron trichloride is a liquefied gas that decomposes in water into hydrogen chloride and boric acid. It is the main gas component in high-K and metal anisotropic plasma etching, atomic layer etching and pulsed plasma etching. BCL3 Gas is also mainly used for fine etching of aluminum circuits in the liquid crystal panel manufacturing process. CAS No. 10294-34-5 UN No. 1741 EINECS No. 233-658-4 Molecular weight 117.19 Appearance colorless fuming liquid or gas with a pungent and sour taste Melting point -107.3℃ Boiling point 12.5℃ Density 1.35 kg/m³ DOT Class 2.3 & 8 Label Toxic Gas, Corrosives

Sulfur dioxide (SO₂) is a colorless liquefied gas with a pungent odor. Dry gas is non-corrosive. Sulfur dioxide can be produced in a variety of ways, such as the combustion of sulfur or pyrite; or, as a by-product of smelter operations. It can also be prepared by the reaction of an acid with a metal sulfide, or by the direct action of sulfuric acid with a metal such as copper. CAS No.  7446-09-5 UN No.  1079 EINECS No.  231-195-2 Molecular weight  64.07 Appearance  colorless, pungent odor Melting point  -75.5 ℃ Boiling point  -10 ℃ Density  2.9275 kg/m³ DOT Class  2.3 & 8 Label  Toxic Gas, Corrosives