Tools & Hardware

T3S, T3SL triple screw pump is used for conveying medium & low viscosity lubricating liquids, it is commonly employed as a hydraulic pump, lubrication pump, light fuel oil pump, and transfer pump in industrial production. Performance parameters (at a speed of 1450 r/min, kinematic viscosity n: 75 mm²/s): Flow rate Q: 26-3000 l/min, operating pressure: 4.0 MPa. Suitable for horizontal, flanged, and vertical installations, with the pump inlet and outlet directions adjustable. The pump has self-priming capability.

Minimum Order: 1 bags

SK water ring vacuum pumps and compressors are used for pumping or pressurizing gases and other non-corrosive, water-insoluble, non-solid particulate gases to form a vacuum or pressure in a closed container to meet the requirements of the process. A small amount of liquid is allowed to be mixed into the sucked or pressurized gas. SK series water ring vacuum pumps and compressors are widely used in machinery, petroleum, chemical, pharmaceutical, ceramics, sugar, printing and dyeing, metallurgy and electronics industries. When SK water ring vacuum pump works, the gas compression is carried out in isothermal state, so when the SK water ring vacuum pump transports the flammable explosive gas, it is not easy to occur danger. The pump is widely used to pump the gas.

Minimum Order: 1 bags

Slip on flanges, also called SO flanges, are a popular type of pipe flange designed to accept pipe into the bore/center of the flange for welding around both the Outer Diameter (OD) of the pipe and on the interior side of the connection. Design & Installation Principle The inner diameter of a slip-on flange is slightly larger than the outer diameter of the pipe, allowing the pipe to slip easily into position. After alignment, fillet welds are applied on both sides to secure the connection. This simple installation method reduces fabrication time and overall installation cost, making slip-on flanges a popular choice for large-scale projects. Standards & Size Range Our slip-on flanges are manufactured in accordance with international standards to ensure compatibility with global piping systems: ANSI / ASME B16.5 (NPS 1/2” – 24”) ANSI / ASME B16.47 (Large Diameter Flanges) AWWA C207 (Waterworks Flanges) EN 1092-1 / ISO 7005 (European Standards) Available sizes typically range from DN15 (1/2”) up to DN600 and above, depending on the applicable standard and project requirements.

Our Cast Iron Gully Grate and Frame is the perfect solution for your drainage needs. Made from high quality cast iron, this grate and frame is durable and long-lasting, ensuring your drainage system stays efficient for years to come. Specifications: 1. Standard: A15, B125, C250, D400, E600, F900 class as per EN124 standard. 2. Materials: Ductile iron/ grey iron. 3. Sizes: Could be all kinds. 4. Type: Square, rectangular. 5. Passed ISO9001: 2008 6. We can also produce as per customers' designs. The Cast Iron Gully Grate and Frame is easy to install and comes in a range of sizes, making it suitable for a wide range of applications and drainage systems. It also has a smooth finish that is easy to clean, helping to maintain the appearance and functionality of your drainage system.

Standard: ISO2531, EN545, EN598 Pressure: PN10/PN16/PN25/PN40 Body material: Ductile iron Coating:      a). Inside cement mortal lining as per ISO4179 , outside zinc primer black bitumen as per ISO8179 ;     b). Inside and outside with FBE ( fusion bonded epoxy) coating or Epoxy painting ;     c). Inside and outside with Epoxy painting ;     d). Inside and outside wih zinc primer black bitumen. Gaskets are SBR, NBR or EPDM; Bolts and Nuts: Carbon steel with galvanized zinc plated G4.8/G8.8, or SS304/SS316. Package: wooden cases and protection layer. Material Ductile iron Standard EN545, EN598, ISO2531, ANSI / AWWA, etc Size DN50-DN2600mm Color Blue, Black, Red Ect. Joint Type Flange type Pressure PN10 / PN16 / PN25 / PN40 OEM Acceptable

Length: 5.7m,6.0m Standard: EN545 Application: Potable Water / Drinking Water Shape: Round Hardness: ≤230HB Pipe Wall Thicness:  C40 Tensile Strength: ≥420Mpa Yield (≥ MPa): 300 MPa Material: Ductile Iron Type: Casting Joint Type: T-type (Push-on) Color: Customer's Requests Surface treatment: Customers' Request OEM: Accept Internal coating: Portland, Sulphate Resistant, High-Aluminum cement mortar lining External Coating: Zinc+bitumen(70microns) painting Delivery: In Container Test: 100% Water Pressure Test Packing: Bundles with steel belt/ Transportation: Bulk Vessel

Ductile Iron Water Pipe is a robust and reliable piping material commonly used in water supply systems. The ductile iron used in these pipes is a type of cast iron that provides high strength, durability, and flexibility, making it ideal for underground and above-ground applications. Material Ductile Cast Iron Type T-Type(push-on joint) Standard EN545 Size DN80-DN2600 Classs K7, K8, K9, C40, C30, C25, etc Length 6m, 5.7m Internal Coating 1. Portland cement mortar lining 2. Sulphate Resistant cement mortar lining 3. High-Aluminum cement mortar lining 4. Epoxy Resin Lining 5. Epoxy Ceramic Lining

Single-screw pump The rotor-type volumetric pump that transports liquids by creating volume changes in the suction and discharge chambers through the intermeshing of the screw and the liner. G-type single-screw pump is an internal meshing rotary positive displacement pump that relies on the interlocking of an eccentric screw (rotor) and a fixed liner (stator) to create volumetric changes in the suction and discharge chambers for liquid transportation. This pump features a compact structure, minimal parts, and easy maintenance, enabling it to transport high-viscosity fluids as well as media containing solid particles or fibers. It boasts stable flow rates, consistent pressure, and strong self-priming capabilities, with flow directly proportional to rotational speed for convenient adjustment. It can operate at temperatures up to 120°C, with an output pressure of approximately 0.6 MPa per stage and a head of 60 meters. Widely used in environmental protection, shipbuilding, petroleum, pharmaceuticals, food, chemical, and paper industries, it is often referred to as the "MONOPUMP" in international markets. The G-type single-screw pump features a compact structure, fewer components, small size, and easy maintenance. Its rotor and stator are wear-prone parts with simple structures, making them convenient for assembly and disassembly. This pump exhibits strong adaptability to media, capable of handling high-viscosity substances (up to hundreds of thousands of centipoise or higher) and media with high solid content (40% to 70%). It can also transport media containing particles or fibers, with particle diameters up to 30 mm and fiber lengths reaching 150 mm. Additionally, it is suitable for conveying sensitive or shear-sensitive media. The pump operates smoothly, characterized by steady flow, stable pressure, no pulsation, and low noise. Its flow rate is directly proportional to the rotational speed, ensuring excellent variable regulation capability. G-type single-screw pump has strong self-priming capability, with a suction lift exceeding 6 meters of water column, and can be installed at any angle. It operates within a wide temperature range, with the standard model capable of reaching up to 120°

Minimum Order: 1 bags

KSW special pump for exhaust tower, idling-capable acid alkali resistant vertical chemical pump for coating electroplating industries. 1. The pump can idle, and pump is damaged for idling. 2. All the liquid parts of the pump are made of corrosion resistant FRPP, CFRPP and PVDF materials, depending on the delivery of chemical liquid 3. The shaft seal design can prevent the chemical gas from damaging the motor bearing, and the free chemical gas can be discharged smoothly through the air hole on the support plate. 4. Closed impeller whose installation has nothing to do with steering. 5. The pump shaft is equipped with a protective cover. 6. Reinforced bearing can resist axial and radial stress. 7. Double layer anti-corrosion spraying Performance range: Frequency :50Hz/60HZ Motor power: 1HP-15HP/0.75KW-115KW Full flow: 280-1710 L/min (50HZ), 250-1950LPM Total head: 16.5-35m(50HZ) /13-35m (60HZ) Main material: FRPP, PVDF Suitable temperature: 0~75℃ (FRPP), 0~90℃ (PVDF) The pump is called as corrosion resistant vertical pump, acid and alkali resistant etching pump, painted vertical pump, vertical pump outside the tank, vertical pump for exhaust tower, vertical pump for engineering plastic, etc.

Minimum Order: 1 bags

Mainly used in the semiconductor packaging industry, it can be used for various types of integrated packaging. Automatic Press-Fit Machine — Precision, Speed, Reliability Upgrade your production line with our Automatic Press-Fit Machine — engineered for repeatable, high-throughput press-fit insertion with industry-grade precision. Built for electronics and connector assembly where consistent force control, part integrity, and uptime matter, our Press Fit Machine combines servo-driven motion, integrated process monitoring, and flexible tooling to deliver fast cycle times and near-zero defect rates. Our Automatic Press-Fit Machine performs controlled press-fit insertions and swaging operations with programmable force profiles, automatic head/tool changes, and optional vision alignment — ensuring every connector or component is seated correctly without board damage. It’s designed for both inline SMT/PCB lines and stand-alone automation cells. Key features ·  Servo-controlled press with force-profile management for repeatable, measurable insertions and automatic reject on out-of-spec events. ·  High-precision positioning & optional vision guidance to align pins/connectors before press-fit, reducing cycle rework. ·  Multi-head / multi-station configurations available for high throughput (parallel insertion) or flexible one-off setups. ·  Smart process monitoring & data logging (SPC) — force/position traceability for quality control and process optimization. ·  Modular tooling and quick-change fixtures so the machine adapts fast to new connector types and board layouts. ·  User-friendly touchscreen HMI and PLC control with recipe management for fast line changeovers. Benefits for your factory ·  Reduce defects & rework — precise force control and vision alignment protect expensive PCBs and components. ·  Increase throughput — configurable multi-head systems and fast cycle recipes maximize production yield. ·  Improve traceability & compliance — built-in logging and reject handling make audits and quality reporting simple. ·  Lower total cost of ownership — robust design, easy maintenance, and modular upgrades keep downtime low. About us: https://www.topleadingintel.com/aboutus/

Mainly used in the semiconductor packaging industry, it can be used for various types of integrated packaging. Tri-Temperature Test Handler — Precision Thermal Test Our Tri-Temperature Test Handler delivers reliable, repeatable thermal testing across the full tri-temp spectrum so you can validate device performance where it matters most — from extreme cold to high heat. Designed for engineering labs and scalable to production lines, this handler combines precise thermal control, high throughput multi-site testing, and broad device compatibility to shorten time-to-market and reduce test costs. Benefits of Tri-Temperature Handler ·  Wide, industry-grade temperature range for true tri-temp testing (cold → ambient → hot), supporting the full range of device characterization and qualification needs. ·  Active thermal control (ATC) and multi-zone temperature management keep DUT temperatures stable and uniform during high-power or long soak tests, improving data quality and yield. ·  Multi-site parallel testing and optimized handling mechanics deliver high units-per-hour throughput while minimizing jams and socket wear — ideal for semiconductor production and high-volume validation. ·  Flexible cooling/heating architectures (LN₂ or modern refrigerant thermal engines) let you match performance to cost and facility constraints. ·  Engineered to support a wide array of package types (QFN, BGA, QFP, TO- packages, SOT23, etc.) and easy kit changeover for fast product mix-shifts. Technical Highlights ·  Full tri-temp capability with precision thermal control for accurate soak and transition cycles. ·  Configurable parallelism (single-site up to multi-site arrays) so you can prioritize throughput or per-device characterization as required. ·  Industry-proven sockets, thermal engines, and pre-heat designs that integrate seamlessly with ATE test heads and common production workflows. ·  Robust mechanical design for long MTBF and easy maintenance — reduces downtime and total cost of ownership. About us: https://www.topleadingintel.com/aboutus/

Mainly used in the semiconductor packaging industry, it can be used for various types of integrated packaging. A final test handler is an automated system used for the final testing of semiconductor devices. It performs critical functions such as device transport, temperature control during testing, and sorting of units based on test results. Through advanced semiconductor testing systems, manufacturers can identify non- compliant devices early, optimize overall production yield, and minimize the risk of failures in critical applications. Advanced Final Test Handling System Modern semiconductor applications demand high-precision, innovative technology — including automated optical inspection (AOI), tri-temperature testing, IC testing, and sensor testing. These processes require reliable, repeatable, and clean test floor environments to ensure the highest levels of quality control and product assurance. As a full-service systems integrator, Top-leading provides comprehensive semiconductor solutions — from Automatic Test Equipment (ATE) to fully Automated Handling Systems. Our expertise covers the design, manufacturing, and service of state-of-the-art device handling solutions — from basic sub-systems to turnkey automation platforms. Flexible and Scalable Final Test Handler Solutions Top-leading's innovative and user-friendly handling systems can be configured as basic, kitless test handlers or expanded into advanced test handling systems through a wide range of optional modules. This flexibility allows users to meet diverse testing requirements efficiently — from R&D environments to high- volume production. Our Test Handler platform covers a wide range of automated test and handling applications, from passive electronic components to semiconductor devices. In addition to standard test handlers for resistors and capacitors, our platform can be extended to semiconductor test handler solutions, including KGD (Known Good Die) handling and testing, supporting customized test flow, sorting logic and automation integration. About us: https://www.topleadingintel.com/aboutus/

Mainly used in the semiconductor packaging industry, it can be used for various types of integrated packaging. Automated Optical Inspection System — Accurate. Fast. Built for Production Deliver defect-free electronics with an advanced Automated Optical Inspection (AOI) System designed for inline production and offline lab use. Our AOI platform combines precision optics, flexible multi-angle lighting, and AI- assisted image analysis to catch soldering faults, component misplacements, missing parts, and surface defects at high speed — reducing escapes, rework, and warranty risk for OEMs and contract manufacturers. Why Choose Our AOI ·  Enterprise-grade accuracy: Custom-engineered ±1µm precision motion stages ensure repeatable, high-resolution imaging for the smallest components and materials. ·  AI + traditional dual-mode detection: Hybrid algorithms combine deterministic rule-based checks with machine learning models to lower false calls while improving detection of new or complex defect types. ·  True 2D/3D inspection and multi-angle imaging: Capture top and side profiles, height/3D features, and perform instant overlay and 3D analysis for tombstoning, solder-volume, and coplanarity checks. ·  Flexible deployment: Modular hardware and software support inline conveyor integration, standalone bench units, or integration with upstream/downstream processes such as barcode marking, laser marking, and robotic loading. ·  Fast programming and traceability: DXF one-click programming and automated recipe generation shorten setup time, while full barcode/lot traceability and reporting simplify process control and customer audits. Key Features: Engineered for Manufacturers ·  High-resolution optical heads with tunable RGB or structured lighting for contrast optimization. ·  Linear servo motor stages and vibration-damped marble platforms for micron-level stability. ·  AI-driven defect classification and automatic defect analysis for faster root-cause feedback. ·  Scalable throughput options: single-board inspection to high-speed inline systems for mass production. ·  Integration with dispensing and fluid-control systems for process verification and automation efficiency. Benefits ·  Reduce escapes and rework costs by identifying defects before assembly proceeds. ·  Shorten NPI cycles with rapid recipe creation and robust programming tools. ·  Improve yield and customer confidence with audit-ready traceability and actionable defect analytics. About us: https://www.topleadingintel.com/aboutus/

Mainly used in the semiconductor packaging industry, it can be used for various types of integrated packaging. Die Bonding Manufacturer - Top-leading In back-end semiconductor manufacturing, the die attach process is a critical step. Top-leading’s die attach equipment is based on unique and innovative concepts, offering economic benefits to customers. The Top-leading Die Bonder is a high-precision assembly system engineered for fully automated die attachment in large-scale production environments. Its modular architecture ensures outstanding process reliability, high throughput, and exceptional flexibility. What is a die bonder? The semiconductor chip manufacturing process is divided into two phases: front-end and back-end. The front-end processing phase involves projecting a circuit pattern onto the surface of a semiconductor wafer so that it is printed onto the wafer, while the back-end processing phase involves dicing the printed wafer into individual chips and assembling them into completed semiconductor devices. Automatic Die Bonder Top-leading's automatic die bonder platforms deliver high-precision solutions for semiconductor and microelectronic assembly. Engineered for superior accuracy, unmatched flexibility, and rapid setup, these systems are ideal for a wide range of applications — from research and development and prototyping to high-mix and volume production. Our die bonders support a broad variety of bonding techniques and component types, making them an excellent choice for advanced packaging and high- precision die attach processes, including: ·  Hi-Rel Devices: High-reliability assemblies for aerospace and industrial applications. ·  Medical Devices: Precision bonding for embedded or monitoring systems. ·  Semiconductor Packaging: Attaching IC dies to packages or substrates. ·  Optoelectronics: Assembly of laser diodes, LEDs, and optical modules. ·  MEMS & Sensors: Integration of microelectromechanical systems and sensor chips. ·  Power Electronics: Bonding high-power dies for automotive and industrial devices. ·  RF & Microwave Modules: Assembly of high-frequency components. Combining micron-level placement accuracy with high-speed operation and exceptional process flexibility, the equipment delivers both precision and performance. Standard features include multi-axis motion control (X, Y, Z, and Theta), vision alignment, and programmable bonding parameters. These capabilities ensure consistent and repeatable results across a wide range of die sizes and materials. About us: https://www.topleadingintel.com/aboutus/