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BGO (Bi4Ge3O12) bismuth germanate crystal is one of the most common oxide scintillation materials. It exhibits stable physical and chemical properties, high mechanical strength, high density, high refractive index, and resistance to harsh environments. With its high stopping power, high scintillation efficiency, good energy resolution and non-hygroscopic, BGO is a good scintillation material for a wide range of applications in high energy physics, space physics, medicine, geological exploration and other industries. OST Photonics can manufacture BGO arrays according to our customers’ different design options in terms of pixel size, the number of pixels, reflector materials and crystal surface finishes. We offer a variety of design options and reflector materials to optimize the array performance. Our manufacturing process can ensure high light output as well as excellent pixel to pixel uniformity with minimal crosstalk. Furthermore, offset BGO arrays (multilayer BGO arrays) are also available upon requests. Applications of BGO Array   Positron emission tomography (PET) High-energy physics Nuclear medicine Geological exploration Gamma-ray spectroscopy Advantages of BGO Array   High Z Good photopeak to Compton ratio The scintillator of choice for neutron activation analysis and active Compton shields High density Specifications of BGO Array Number of pixels: 4x4; 8x8; 16x16; 24x24; 30x30 etc. (customized upon request) Minimal pixel size: 0.2 mm x 0.2 mm Reflector Types and Thicknesses of BGO Array Material Thickness of reflector material + adhesive BaSO4 ≥0.1 mm ESR 0.08 mm E60 0.075 mm TiO2 ≥0.1 mm Properties of BGO Crystal Density [g/cm3] 7.13 Melting point [K] 1323 Thermal expansion coefficient [C-1] 7 x 10-6 Cleavage plane None Hardness (Mho) 5 Hygroscopic No The wavelength of emission max. [nm] 480 Refractive index @ emission max 2.15 Primary decay time [ns] 300 Light yield [photons/keVγ] 8-10 Photoelectron yield [% of NaI(Tl)] (for γ-rays) 15–20 Afterglow 0.005%@3ms Quality Control for BGO Array: Dimension testing Relative light output testing Pixel light output uniformity: ≤10%；≤20%；≤30% or on request Energy resolution testing Scatter map.

Minimum Order: 1 bags

The SCM200 M2M chip personalization data writing machine can perform electrical performance testing, personalized data writing, and surface laser personalized printing on M2M chips, automotive electronic SE (Security Element - security chips), eSIM and other smart devices in QFN, DFN, VSOP8, WLCSP and other packaging forms. SCM200 can provide stable WLCSP chip personalization data writing production services for global mobile operators, smart device foundries, and automotive electronic security chip manufacturers, and can flexibly and quickly switch production orders of different packaging forms. Specifications of SCM200 M2M Electronic Chip Making Machine PARAMETER Overall Dimension 1250mm×950mm×1870mm(Excluding the tape bracket part) Weight 450Kg Power Supply 220V(-5%～+10%), 50Hz, 3KW Noise ≤65dB Operation Temperature 23℃±3℃ Operation Humidity 50±10%rh Compressed Air stress: 0.5Mpa Flow rate: 3300L/M Communication Interface Ethernet Functions of SCM200 M2M Chip Personalization Machine PARAMETER Equipped with two chip storage stations. The chips are positioned to ensure accurate placement, and this mechanism includes a pin turning function, which can rotate the chips by 90° or 180°. Two sets of chip positioning units are placed at the post station of the tape feeding unit and the pre station of the tape receiving unit, respectively, for direction adjustment when the chip enters the writing station and when the chip is collected. Standard configuration of four read-write stations, expandable to eight. Standard configuration of one PIOTEC reader-writer PT204PT-AMA, expandable to two. It can perform personalized data writing and online card replenishment functions on the chip, supporting 7816, serial port, Bluetooth, SPI and I2C protocols. IC data verification function can be realized. Equipped with a 20W fiber laser marking machine. Equipped with a smoke purifier. Equipped with a set of 5 million pixel CCD industrial cameras and light sources. Equipped with a set of OCR (Optical Character Recognition software). Advantages of SCM200 M2M Chip Personalization Machine WHY High Stability: The equipment failure rate is less than 0.01%. Focused on WLCSP chip personalized data writing production. High-precision mechanical handling mechanism, supporting chips as small as 1.4*1.4mm. High Compatibility Supports production of chips of up to a dozen different sizes, and switching between different chip specifications takes only 20 minutes. Supports two ways of feeding: tray and feeder. Fully supports secondary development to meet various customization needs. High Cost-Performance Ratio Integrates a variety of independently developed core technologies, reducing procurement costs by 15%. Fewer consumable parts and longer life, reducing maintenance costs by 20%. High Flexibility Small footprint, flexible configuration. As a smart card company, we will do our best to meet all the needs of customers.

Minimum Order: 1 bags

PTM-120B can be integrated short-circuit punching,open and short test,chip initialization & pre-personalization as well as reject chip punching and marking.The brand-new design enables operators to switch chips production between 6PIN and 8PIN within 60 seconds. Modular design can meet your different production requirements and maximize decreasing your investment cost. PTM-120B can be applied to contact/contactless and dual interface chip initialization,and also can be customized according to the demands for various chip production. Specifications of PTM-120T Chip Module Initialization and Testing Machine PARAMETER Capacity 53000UPH Dimension 4750mm×840mm×1960mm(including broken reinforcement units); 3800mm×840mm×1960mm(excluding broken reinforcement units) Weight 800kg (including broken reinforcement units); 650kg (excluding broken reinforcement units) Power Supply 220V (-5%~+10%) 50Hz 4KW (including broken reinforcement unit); 220V (-5%~+10%) 50Hz 2KW (excluding broken reinforcement units) Air Supply No air source required Noise ＜50dB Operation Temperature Room temperature: 23℃±3℃ Operation Humidity 50±10％ Maximum Throughput 60,000 UPH (including broken reinforcement units); 120,000UPH (6PIN, excluding broken reinforcement unit) Short-circuit Punching Throughput Maximum production capacity 60000 UPH (14 pieces per round) Chip Module Specification M2, M3 Communication Interface Ethernet Functions of PTM-120T Chip Module Initialization and Testing Machine PARAMETER Discharge Unit The position adjustment of the active and driven material trays is convenient and can adapt to different incoming directions; Compatible with 12.6MM and 38MM shaft diameter material trays. Main Writing/testing Unit Compatible with 6PIN and 8PN chip production; Supports up to 120 contact test heads and 12 non-contact test heads simultaneously for electrical performance testing and data writing of contact, non-contact, or dual interface modules; Alternatively, 60 contact test heads and 60 non-contact test heads can be configured according to customer requirements. This unit can work independently. Supplementary Writing/testing Unit Configure 2 sets of contact test heads or 3 sets of non-contact test heads to automatically write/test failed chips, minimizing waste. Gun Waste Unit The identification of punch holes for chips that have failed to write or test can be flexibly set through software without the need for manual adjustment, greatly improving the accuracy and production efficiency of punch holes; This unit can work independently. Material Receiving Unit Roll up the written and tested strips and wrap them with protective tape; This unit can work independently. Broken Reinforcement Unit (Optional) Capable of cutting the connecting ribs of chip strips; By changing the mold, it is easy to cut different specifications of chip strips; This unit can work independently. Advantage of PTM-120T Chip Module Initialization and Testing Machine WHY Unique patented technology 1. The equipment is compatible with 6pin and 8pin module strip production. 2. Unique patented technology for fast switching of chip types: It can quickly switch between 6pin and 8pin production tasks within 60s without removing and inserting cables. 120 Heads ensure high throughput Max.throughput 100,000cph for 6PIN chip; Max.throughput 77,000cph for 8PIN chip. High-performance reader The top Chinese industrial-class reader developed by Piotec with open/short test function is stable and high cost-effective. Visual inspection Independent side hole visual detection module can carry out high-speed and high-precision real-time detection of side holes and waste holes to ensure the accuracy and precision of side hole detection. The flexible testing scheme is suitable for different IC module applications. Reject chip punching module Independent punching mechanism can accurately set the punching position of double row chip through parameters (XY direction can be used), without adjusting the position of mechanical structure, high precision and good punching consistency. Unrestricted workplace Free of production site due to electric driving design without external air supply. Electrical performance parameters testing items Open-short test for pins (positive and negative current is adjustable). Leakage current test supported. Static current test supported. FVMI and FIMV (V=f(I), I=f(V)) supported. Pin voltage value of Vih and Vil is Adjustable. We can offer types of credit card making machine for sale , if you have needs to buy credit card creator machine, credit card maker machine, credit card manufacturing machine, please contact us. If you want to know more about credit card manufacturing process, please visit our website. As a smart card supplier, we will do our best to meet all the needs of customers.

Minimum Order: 1 bags

BGO scintillation crystal is one of the most common oxide scintillation materials. It exhibits stable physical and chemical properties, high mechanical strength, high density, high refractive index, and resistance to harsh environments. With its high stopping power, high scintillation efficiency, good energy resolution and non-hygroscopic, BGO is a good scintillation material for a wide range of applications in high energy physics, space physics, medicine, geological exploration and other industries. OST Photonics can supply BGO crystals, BGO arrays and BGO scintillation detector upon request. We can offer a variety of design options and reflector materials to optimize array performance and ensure the array's high light output, excellent uniformity and minimal crosstalk. Application of BGO Scintillators (Bismuth Germanate Scintillators) Positron emission tomography (PET) High-energy physics Nuclear medicine Geological exploration Gamma-ray spectroscopy Advantages of BGO Scintillators (Bismuth Germanate Scintillators) High Z Good photopeak to Compton ratio The scintillator of choice for neutron activation analysis and active Compton shields High density The Ability of OST Photonics Maximum Size: ɸ76mm x 300mm, 40mm x 80mm x 200mm Available items: monolithic crystal, pixellated array, scintillation detector Properties of BGO Scintillators (Bismuth Germanate Scintillators) Density [g/cm3] 7.13 Melting point [K] 1323 Thermal expansion coefficient [C-1] 7 x 10-6 Cleavage plane None Hardness (Mohs) 5 Hygroscopic No The wavelength of emission max. [nm] 480 Refractive index @ emission max 2.15 Primary decay time [ns] 300 Light yield [photons/keVγ] 8-10 Photoelectron yield [% of NaI(Tl)] (for γ-rays) 15–20 Afterglow 0.005%@3ms

Minimum Order: 1 bags

This product is designed for various types of smart cards that comply with ISO/IEC7816 regulations. It uses visual recognition systems, contact IC recognition, and non contact IC recognition to read and recognize information on the card surface or inside the chip. The identified data is matched with the database memory data information to determine the current card sequence number, thereby achieving card sorting and ranking. During the production process, custom smart card that fail inspection and missing cards will be replaced with specially designed replacement identification cards. After each unit sorting is completed, a box sorting identification card will be inserted. Specifications of PTE-S5000-Smart Card Sorting Machine and Ranking Machine PARAMETER Capacity 5000uph Dimension 3520mmx 880mmx 1920mm Weight 1400kg Power Supply 220V, 50Hz, 5KW Air Supply 0.6Mpa Noise ＜65dB Operation Temperature Room temperature: 23℃±3℃ Operation Humidity 50±10％ Communication Interface Ethernet Adapt to Card Type Supports various ISO ID-1/CR-80 compliant cards such as PC, PET, PVC, ABS, etc. (53.98 mm x 85.60 mm) Functions of PTE-S5000-Smart Card Sorting and Ranking Machine PARAMETER Card Issuing Unit 1 set of removable card box with a maximum capacity of 500 cards. Flipping Unit 2 sets, adjusting the card direction to achieve recognition and verification of card surface information and chip information under different card surface conditions. Identification Unit 2 sets, including OCR visual recognition, contact IC recognition, and non- contact IC recognition. Read and recognize the information on the surface of the card or inside the chip, and match it with the data in the database to determine the current card sequence number. Cache Unit 1 set, cache cards that belong to the current sorting range but do not belong to the current sorting unit, and have automatic card sending and receiving function. Card Sorting Unit 2 sets of sorting turntables, each set storing 250 cards, totaling 500 cards. Verification Unit 1 set, including OCR visual verification, contact IC verification, and non- contact IC verification, which can read and verify card surface and chip internal information. Card Receiving Unit Adopting a turntable card receiving structure, equipped with 2 finished card receiving boxes with a capacity of 500 sheets, which can be automatically switched; A filling identification card box with a capacity of 200 sheets; A waste card box with a capacity of 200 sheets Recycling Box Recycling cards that do not belong to the current sorting range, with a capacity of 50 cards. Advantages of PTE-S5000-Smart Card Sorting and Ranking Machine WHY 01 It can be applied to various types of smart cards according to ISO/IEC 7816 regulations. 02 Automatically issue identification cards to ensure continuous card sorting in case of card shortage. 03 The cache unit can cache 2500 cards and supports automatic card sending and receiving functions. 04 Multiple verification methods can be used to verify the internal and external information of the card. Ensure that the information inside and outside the card is consistent and the card sorting preparation is correct. 05 Automatically issue a box splitting identification card, eliminating the need for re box splitting after receiving the card. 06 An efficient dual rotary sorting mechanism with fast speed and high stability. As one of smart card solution providers, we can offer kinds of related products for sale, if you are interested, please contact us.

Minimum Order: 1 bags

BaTiO3 single crystal has excellent photorefractive properties, high self- pumped phase conjugate reflectivity and two-wave mixing (optical amplification) efficiency, and has huge potential application prospects in optical information storage. At the same time it is also an important substrate substrate material. OST Photonics offers high quality BaTiO3 substrates for researchers and industries. Crystal orientation, size and thickness can be customized according to your requirements. Application of BaTiO3 Substrates Optical information storage Substrate for epitaxial growth Advantages of BaTiO3 Substrates Excellent photo-refractive properties Excellent ferroelectric properties High self-pumped phase conjugate reflectivity High two-wave mixing (optical amplification) efficiency Ability of BaTiO3 Substrates Orientation:<100>,<001& , gt;,<110>,<111>, etc. Dimension: 10x10mm, 10x5mm, 5x5mm, etc. Thickness: 0.5mm, 1.0mm, etc. Available items: substrates, blanks and customized optics Specification and Properties of BaTiO3 Substrates　 Crystal System Tetragona(4m):  13℃< T<132℃ a=3.99Å, c= 4.04Å (at 26℃) Density 6.02 g/cm3 Melt Point 1612 ℃ Growth Method TSSG (Top Seeded Solution Growth) Dielectric Constant ea=3700 ec=135(unclamped) ea=2400 ec=60 (clamped) Refractive Index 515nm 633nm 800nm no 2.4912 2.4160 2.3681 ne 2.4247 2.3630 2.3235 Transmit Wavelengths 0.43-6.30μm Photoelectric Coefficient rT13=8±2 pm/V  rT33=105±10 pm/V  rT42=1300±100 pm/V Reflectivity of SPPC (at 0 deg. cut） 50 - 70 % for λ = 515 nm(Ce:BaTiO3) 40 - 60 % (Pure BaTiO3) for λ = 515 nm 50 - 80 % for λ = 633 nm(Ce:BaTiO3) 40 - 60 % for λ = 633 nm (Pure BaTiO3) Two-wave Mixing Coupling Constant 10 -40 cm-1 Absorption Loss λ: 515nm λ: 633nm λ: 800nm α: 0.285 cm-1 α: 0.108 cm-1 α: 0.033 cm-1 Orientation <100>,<001>,<110>,<111>, etc. Orientation Tolerance ±0.5° or better Dimension 10x10mm, 10x5mm, 5x5mm, etc. Dimension Tolerance ±0.1 mm or better Thickness 0.5mm, 1.0mm, etc. Thickness Tolerance ±0.05 mm or better Surface Finish Single side polished (SSP)/Double sides polished (DSP) Surface Roughness Ra<10Å Atomic Particle Microscopy (AFM) test report can be provided. Package Class 100 clean bag, Class 1000 super clean room Note: The BTO substrates are poled, but with domains BTO single crystal must be stored in temperature above 13 ℃ to avoid phase transition which will cause twin or domain inside crystal

Minimum Order: 1 bags

PTCME302 represents a new generation of high-speed smart card module adhesive packaging, packaging thickness measurement, and packaging appearance inspection system. 100% online control of the entire process, minimizing manual intervention and saving labor costs. The latest gluing program design of the 16 nozzle gluing head makes the gluing quality higher, easier to maintain, and thus achieves simpler operations. Compared with traditional UV gas discharge lamps, the curing unit configuration of PTCME302 significantly reduces the space occupied by the LED UV lamp, while increasing its power, resulting in higher production efficiency. To save factory labor costs and effectively control product quality, PTCME302 is equipped with module packaging thickness detection units and module strip surface defect detection units. Specifications of PTCME302-Chip Module Encapsulation Machine PARAMETER Capacity Full fill: 33000UPH; Dam filling: 23000UPH Dimension 7300mm×1200mm×2000mm Weight 2100Kg Power Supply 220V(-5%～+10%), 50Hz, 8KW Air Supply Pressure: 0.6Mpa; Flow rate: 1500LPM Noise ≤65dB Operation Temperature Room temperature: 23℃±3℃ Operation Humidity 50±10％ Functions of PTCME302-Chip Module Encapsulation Machine PARAMETER Issuing/receiving Unit 1. Loadable inner diameter φ 40mm (without keyway), outer diameter φ 500mm material tray. 2. Loadable inner diameter φ P40mm (without keyway), outer diameter φ 500mm protective belt material tray. Stripe Drive Unit 1. Equipped with strip tensioning, forward transmission, and reverse rewinding functions. 2. Using servo motor and needle wheel for strip transmission. 3. Strip running accuracy ≤ ± 0.1mm. Feed Detection Unit 1. Used to detect waste holes and edge holes in strip incoming materials. 2. Install X/Y sliding table at the bottom of the mechanism for precise adjustment of sensor position. Gluing Unit 1. Equipped with 2 sets of adhesive heads suitable for 9.5mm specification strips, each with 16 adhesive nozzles. 2. Optional 14.25mm adhesive head, with 16 nozzles for each adhesive head. 3 Applicable types of glue include: dam building glue and filling glue. 4. The gluing head is driven by an X/Y/Z three-axis motion mechanism, with a three-axis motion accuracy of ≤ ± 0.1mm and a sealing thickness accuracy of ≤ ± 0.03mm. 5. The zero position correction function of the Z axis of the glue nozzle allows for recalibration of the height of the Z axis of the glue nozzle after replacing the glue head. Visual Positioning Unit 1. Each adhesive unit is equipped with a visual positioning system after installation. 2. The visual positioning system has module strip positioning function and adhesive detection function. 3. The visual positioning system and the three-axis motion mechanism of the gluing unit are linked and controlled to ensure the position accuracy after gluing is ≤ ± 0.1mm. 4. Configure a 5 megapixel camera. UV Curing Unit 1. Configure a 1.2 meter V lamp system. 2. The UV lamp can be automatically raised and lowered through software control. When the UV lamp experiences attenuation, the curing effect of the UV lamp can be improved by adjusting the height of the lamp. 3. The overall UV lamp can be moved backwards through software control and has the function of flipping backwards by 90 °, making it convenient for U replacement or maintenance. Thickness Measuring Unit 1. Simultaneously configure 8 length meters. 2. Equipped with adjustment functions in X, Y, and Z directions. Gun Waste Unit 1. Treatment of chip gun waste holes that fail thickness testing and adhesive appearance defect testing. 2.Use the chasing gun waste mode, with a diameter of 2 ± 0.1mm and a positional error of ≤ ± 0.2mm. Advantages of PTCME302-Chip Module Encapsulation Machine WHY 01 Real time monitoring of adhesive coating effect and packaging thickness. 02 Visual adhesive trajectory design allows for easy creation of adhesive paths. 03 Glue coating accuracy ± 30um Damming and filling or double filling production mode. 04 Fully automatic X/Y direction adjustable gun waste hole function detailed production data report. 05 Optional visual defect detection function. Now the id card making machine price is reasonable, if you have needs to buy identity card making machine, please contact us. If you want to know more smart chip card solutions, please visit our website.

Minimum Order: 1 bags

BaF2 barium fluoride crystal is the scintillation crystal with the fastest decay time found so far, it has a fast component with a scintillation decay time of 0.9ns and a peak emission wavelength of 220nm. BaF2 scintillator has a wide application prospect in the fields of high energy physics, nuclear physics and nuclear medicine. OST Photonics can supply BaF2 crystals in different specifications upon your request. Application of BaF2 Scintillators (Barium Fluoride Scintillators) High energy physics Nuclear physics Nuclear medicine UV and IR optical windows Advantages of BaF2 Scintillators (Barium Fluoride Scintillators) Fastest decay time High density Refractive index matching The Ability of OST Photonics Maximum Size: ɸ120mm x 200mm Available items: monolithic crystal Properties of BaF2 Scintillators (Barium Fluoride Scintillators) Density (g/cm3) 4.89 Melting Point (℃) 1280 Crystal Structure Cubic Decay Constant (ns) 620 slow; 0.6 fast Cleavage Plane (111) Index of Refraction 1.4624@2.58μm / 1.3936@10.35μm Reflection Loss (both surfaces) 6.8% @2.58μm / 5.3% @10.35μm The wavelength of Max Emission (nm) 310 slow; 220 fast Hardness (Mho) 3 Hygroscopicity Slightly Radiation Length (mm) 20.6 Light Output of NaI(Tl) 20% slow; 4% fast Transmittance Range (μm) 0.15~14 Transmittance >94% @0.35 ~ 10.8μm

Minimum Order: 1 bags

PTA-8500C is a new member of the 8500 series, mainly used for personalized data writing of ss card maker , Integrate highly stable contact and non-contact IC writing mechanisms that have been widely validated in the industry for over 10 years. Equipped with a large number of contact and non-contact IC writing stations in the industry so far, and equipped with both internal and external card configurations Information verification unit to achieve minimum manpower investment and stable data writing for large capacity generate social security cards capacity output. Specifications of PTA-8500C Social Security Card Personalization Machine PARAMETER Capacity 3000uph Dimension 3850mm×910mm×1900mm Weight 1000KG Power Supply 220V (-5%~+10%) 50HZ 6KW Noise ＜65dB Operation Temperature 23℃±3℃ Operation Humidity 50±10％ Compressed Air Pressure: 0.5Mpa; Flow rate: 400L/min Communication Interface Ethernet Functions of PTA-8500C Social Security Card Personalization Machine PARAMETER Card Receiving/Dispensing Unit 1. Two removable card boxes are configured separately, with a maximum capacity of 500 cards per box. 2. Can achieve automatic box replacement. Visual Recognition Unit (OCR) Before writing the data, identify the surface information of the card and obtain the number of cards from the database Sexual data. Contact IC Card Writing Unit 1. Can achieve data writing of standard social security cards. 2. Standard configuration includes 32 contact IC card writing stations, with a maximum of 64 expandable configurations. Contactless IC Card Writing Unit 1. Can write non-contact data of social security cards. 2. Standard configuration includes 16 non-contact IC card writing stations, with a maximum of 64 expandable configurations Contactless IC card writing unit. Magnetic Writing Unit 1. Integrated industrial grade magnetic stripe data writer with long-term market validation. 2. It can write card magnetic stripe data and verify its written content. IC Calibration Unit 1.1 contact IC data verification units for verifying data written to the contact IC. 2.1 non-contact IC data verification units for verifying data written to non- contact ICs. Visual Verification Unit (OCR) After data is written, the surface information of the card is identified to verify the accuracy of external information Accuracy. Advantages of PTA-8500C Social Security Card Personalization Machine WHY High Compatibility Equipped with a large number of contact and non-contact IC writing stations in the industry to date, providing stable output capacity for data writing of large capacity social security cards. High Stability Equipped with industrial grade contact and non-contact readers independently developed by Peltec, with an open system architecture, fully supporting secondary development, it can meet the high-speed and stable needs of various smart card manufacturers. High Speed A complete and mature secondary development solution that can achieve rapid integration with various production management systems, reducing customer migration costs. As a smart card factory, we can offer kinds of high quality products for sale, if you are interested, please contact us.

Minimum Order: 1 bags

Custom Carbon Steel Forgings For Automotive Manufacturing Spindles Forging Forging Steel Aluminium Alloy Inner Gear Ring Product Description: Hot Forging is a process that involves die forging of ASTM 4140 forgings to produce different shapes and pieces such as rings, threaded, shafts and flanges. This process is widely used in the automotive and machinery industries due to its superior performance. The product has a tolerance of ±1-2.5mm and the minimum order quantity (MOQ) is 300 pieces. Heat treatment including normalizing and tempering is also available. In addition, we offer custom OEM/ODM services to meet customer's specific requirements. Features: Product Name: Hot Forging Heat Treatment: Normalizing And Tempering Payment Term: T/T Packaging: Carton, Wooden Case, Etc. Processing: Hot Forging Lead Time: 15-45days Keywords: Hot Forged Bolts, Custom Industrial Forgings, Sleeves Forging, Rings Forging Technical Parameters: Parameters Details Service OEM/ODM Tolerance ±1-2.5mm Processing Hot Forging, Valve Body Forging, Die Forging, Custom Forging Packaging Carton, Wooden Case, Etc. Lead Time 15-45days Material Steel, Alloy Steel, Stainless Steel, Aluminum Alloy, Copper, Titanium Heat Treatment Normalizing And Tempering MOQ 300 Pieces Application Automotive, Machinery, Etc. Payment Term T/T Applications: ODM is a professional hot die forging manufacturer, dedicated to providing custom industrial forgings for automotive, machinery and other fields. The brand product hot forging is made in Quanzhou China, with an minimum order quantity of 300 pieces and a negotiable price. The packaging of the product is according to customers' requirement and the delivery time is from 10 to 60 days. The accepted payment terms are TT, and the supply ability is 3000- 5000 T per month. The tolerance of the product is ±1-2.5mm. The MOQ is 300 pieces and the service provided is OEM/ODM. The application of the product is for automotive, machinery and other fields, and the processing is hot forging. Custom Carbon Steel Forgings For Automotive Spindles Aluminium Alloy Inner Gear Ring 0Custom Carbon Steel Forgings For Automotive Spindles Aluminium Alloy Inner Gear Ring 1Customization: We offer custom Hot Forging services with Brand Name ODM. Our place of origin is Quanzhou, China. The price is negotiable. We have a minimum order quantity of 300 pieces. The packaging details, delivery time, payment terms, and supply ability are as follows: Packaging according to customers' requirement, 10-60 days delivery time, TT payment terms, and 3000-5000 T per month supply ability. We use Steel, Alloy Steel, Stainless Steel, Aluminum Alloy, Copper, and Titanium as material. The processing used is Hot Forging and the packaging is Carton, Wooden Case, etc. The payment term is T/T. Our specialty is Closed Die Forging, forged flange, and hot drop forging. Support and Services: Hot Forging Technical Support and Services We offer a wide range of technical support and services for our hot forging products. Our team of experts can provide you with advice and assistance on a variety of topics, including product selection, installation, and maintenance. Our experienced team of engineers can provide technical support in the areas of: Design and analysis Process optimization Material selection Tooling design Equipment maintenance and repair Troubleshooting We also offer a range of services, such as: On-site inspections and assessments Training and education Consulting services Product testing and certification Product customization After-sales support Our team of experts is available to answer your questions and provide advice and support on all aspects of hot forging. Contact us today to learn more about our technical support and services. Packing and Shipping: Hot Forging Packaging and Shipping: At our facility, hot forging products are securely packaged and shipped through our trusted carriers. Each product is carefully inspected and secured to ensure it arrives in pristine condition. All protective packaging materials, such as foam, bubble wrap, and other cushioning materials, are used to prevent damage during transit. The package is then labeled with the product information, destination, and other pertinent information in order to ensure speedy and accurate delivery. FAQ: Q: What is Hot Forging? A: Hot Forging is a process where metal is heated to a temperature that makes it easier to shape. It is then forced into a die to create the desired shape. Q: What is the Brand Name of Hot Forging? A: The Brand Name of Hot Forging is ODM. Q: Where is the Place of Origin of Hot Forging? A: The Place of Origin of Hot Forging is Quanzhou, China. Q: What is the Minimum Order Quantity of Hot Forging? A: The Minimum Order Quantity of Hot Forging is 300. Q: How much does Hot Forging cost? A: The price of Hot Forging is negotiable.

Anamorphic prisms are utilized to rectify the asymmetric and elliptical beams generated by laser diodes, resulting in nearly circular beam shapes. By utilizing an anamorphic prism, the beam size can be altered along one axis while remaining unaltered along the other axis, allowing for expansion, reduction or reshaping of the beam. Specifications of Anamorphic Prisms Material: N-SF11, H-ZF13 Grade A optical Glass Dimension Tolerance (mm): +/-0.2 (General), +0/-0.1 (High Precision) Theta: q = 29°27'±30" Flatness (per 25mm@633nm): λ/2(General), λ/10 (High Precision) Clear Aperture: >80% (small size),>90%(large size) Surface Quality: 60/40 (General), 10/5 (High Precision) Bevel (mm): 0.1-0.5 Coating on input and output sides: MgF2 single layer on perpendicular surface or AR coating--Unpon Request Note for Anamorphic Prisms Anamorphic prism is available upon requirement. Note: The prism is counted quantity at every piece. It shall be used as pair (two pieces).

Minimum Order: 1 bags

New All Aluminum Bleacher is a new popular trend, and we also can call it Tip N roll aluminum bleachers, sports bench, portable sports bench, mobile bleachers, gym bleachers, indoor and outdoor bleacher, bleacher seats etc. Features of New All Aluminum Bleacher New fashion model design Customized rows and length etc Easy to install and move Options of New All Aluminum Bleacher Model No. Type Material Dimension(mm) Application Custmized or not NLD-3 Low back Aluminum 3500(W)X1700(D)X923(H)mm Stadiums, football clubs, arenas etc Yes NLP-2 Without back Aluminum 3500(W)X930(D)X629(H)mm Stadiums, football clubs, arenas etc Yes NLP-4 Without back Aluminum 3500(W)X2410(D)X1388(H)mm Stadiums, football clubs, arenas etc Yes As one of aluminum bleacher manufacturers, we can offer kinds of aluminum bleachers for sale, if you are interested, please contact us. If you want to know more types of synthetic grass china, please visit our website.

α-BBO (α-BaB2O4) is a negative uniaxial crystal which has large birefringence over a broad transparent range of 190nm to 3500nm. α-BBO is an excellent crystal especially in UV and high power applications. The physical, chemical, thermal, and optical properties of alpha-bibo nonlinear crystal are similar to those of Beta-BBO. However, there is no second order nonlinear effect in alpha-BBO crystal due to the centrosymmetry in its crystal structure and thus it has no use for second order nonlinear optical processes. Instead, alpha-BBO is widely used for fabrication of polarizers, polarizing beam displacers, phase retarders, birefringent plates, and time delay compensators especially those for UV and high power lasers. Applications of α-BBO Crystals High power Beam displacers for isolators. High power Polarizer Time delay compensators Advantages of α-BBO Crystals High UV transmittance Large birefringence High damage threshold Specifications of α-BBO Crystals Tolerance of cutting angle △θ≤±0.25°,△φ≤±0.25° Dimension To , lerance ±0.1mm Flatness λ/10 @ 632.8nm Wavefront distortion λ/4@ 632.8nm Surface Quality 10/5 per MIL-O-13830B Parallelism 10″ Perpendicularity 10′ Bevel/Chamfer <0.1mm@45deg. Chips <0.1mm Clear Aperture >95% Coating AR/HR (IAD, EB, IBS) coating upon customer’s request Damage Threshold 750MW/CM2 at 1064nm, TEM00, 10ns, 10Hz Quality Warranty Period One year under proper use   Basic Properties of α-BBO Crystals Transparency Range 190-3500nm Hygroscopic Susceptibility Low Density 3.85g/cm3 Mohs Hardness 4.5 Thermal Expansion Coefficients（/℃） 9.3×10^-6（C） 9.5×10^-6（A） Damage Threshold 1GW Refractive Indices no=1.6776，ne=1.5534，at 532nm no=1.6579，ne=1.5379，at 1064nm Sellmeier Equation（λ in μm） no²=2.7471+0.01878/(λ²-0.01822)-0.01354λ² , ne²=2.37153+0.01224/(λ²-0.01667)-0.01516λ²

Minimum Order: 1 bags

Metal Bleachers for Sale Metal Bleacher has several options to choose what kind of seats to be installed on the bleacher, just like plastic injection seats, blowing seats, no matter low back, middle back or high back etc. Features of Metal Bleacher Modular design, quick assembly Easy transportation and storage Plenty of seat options available Options of Metal Bleacher Model No. Type Material Seat Material Application Custmized or not ZS-DKB-2 Low back Metal HDPP Stadiums, football clubs, arenas etc Yes ZS-ZKBB-3 Middle back Metal HDPP Stadiums, football clubs, arenas etc Yes ZS-ZKBB-4 Middle back Metal HDPP Stadiums, football clubs, arenas etc Yes If you want to know more types of synthetic turf china, please visit our website.

Minimum Order: 50