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This type of small plasma sputtering coating machine adopts two-stage sputtering method, which is widely used for SEM sample preparation or metal coating experiment. Using low-temperature plasma sputtering process, there is no high temperature during the coating process, and it is not easy to produce thermal damage. This equipment is equipped with a rotatable heating sample stage, which can improve the uniformity of the coating and the adhesion of the film.This small plasma sputtering instrument uses a PLC control system, all touch screen operation, easy to learn and use. The equipment is small in size and beautiful in appearance, making it the best choice for laboratory coating experiments. Technical parameters: Sample stage size 100mm Distance from sample stage to target surface 20~35mm height adjustable Rotating speed 1~20rpm adjustable Heating temperature ≤500℃ Temperature control accuracy ±1℃ PID temperature control Plasma sputtering source 2 inches x1 Cooling method Water cooling/Natural cooling Vacuum chamber size φ180mm x 210mm Observation window Omnidirectional visibility Chamber material High purity quartz Open method Top cover removable Upper and lower cover material 304 stainless steel Pumping port KF16 Intake port 1/4 inch ferrule connector Power configuration Quantity DC power supplyx1 Output power Max. 150W Sputtering power 1200V Max. sputtering current 50mA Vacuum pump type Dual-stage rotary vane vacuum pump Pumping port KF16 Exhaust interface KF16 Pumping rate 1.1L/s（4m3/h） Ultimate vacuum ≥0.1Pa Vacuum measurement Resistance vacuum gauge Power supply AC 220V 50Hz Total power 1.5kW/2kW Dimension 500mm x 320mm x470mm Weight 30kg

Minimum Order: 1 bags

This type of small plasma sputtering coating machine adopts two-stage sputtering method, which is widely used for SEM sample preparation or metal coating experiment. Using low-temperature plasma sputtering process, there is no high temperature during the coating process, and it is not easy to produce thermal damage. This small plasma sputtering coater uses PLC control system, all touch screen operation, easy to learn and use. This model machine is also equipped with a rotatable sample stage, which can effectively improve the uniformity of the coating. Technical parameter Sample stage size 100mm Distance from sample stage to target surface 20~35mm height adjustable Rotating speed 1~20rpm adjustable Plasma sputtering source 2-inches x2 Cooling method Water cooling/Natural cooling Vacuum chamber size φ180mm x 210mm Observation window Omnidirectional visibility Chamber material High purity quartz Open method Top cover removable Upper and lower cover material 304 stainless steel Pumping port KF16 Intake port 1/4 inch ferrule connector Power configuration Quantity DC power supplyx1 Output power Max. 150W Sputtering power 1200V Max. sputtering current 50mA Vacuum pump type Dual-stage rotary vane vacuum pump Pumping port KF16 Exhaust interface KF16 Pumping rate 1.1L/s（4m3/h） Ultimate vacuum ≥0.1Pa Vacuum measurement Resistance vacuum gauge Power supply AC 220V 50Hz Total power 1.5kW/2kW Dimension 500mm x 320mm x470mm Weight 30kg

Minimum Order: 1 bags

This type of small plasma sputtering coating machine adopts two-stage sputtering method, which is widely used for SEM sample preparation or metal coating experiment. Using low-temperature plasma sputtering process, there is no high temperature during the coating process, and it is not easy to produce thermal damage. This small plasma sputtering coater uses PLC control system, all touch screen operation, easy to learn and use. Technical parameter Sample stage Size 100mm Distance from sample stage to target surface 20~35mm height adjustable Heating temperature ≤500℃ Temperature control accuracy ±1℃ PID temperature control Plasma sputtering source Quantity 2 inchesx1,Natural cooling Vacuum chamber Chamber size φ180mm x 210mm Observation window Omnidirectional visibility Chamber material High purity quartz Open method Top cover removable Upper and lower cover material 304 stainless steel Pumping port KF16 Intake port 1/4 inch ferrule connector DC power supply x1 Output power Max. 150W Sputtering power 1200V Max. sputtering current 50mA Vacuum system Vacuum pump type Dual-stage rotary vane vacuum pump Pumping port KF16 Exhaust interface KF16 Pumping rate 1.1L/s（4m3/h） Ultimate vacuum ≥0.1Pa Vacuum measurement Resistance vacuum gauge Power supply AC 220V 50Hz Total power 1.5kW/2kW Dimension 500mm x 320mm x470mm Weight 30kg

Minimum Order: 1 bags

Magnetron sputtering is a kind of Physical Vapor Deposition (PVD).General sputtering method can be used to prepare metal, semiconductor, insulator and other materials, and has the advantages of simple equipment, easy control, large coating area and strong adhesion. This device can be used for preparing single-layer or multi-layer ferroelectric thin films, conductive films, alloy films, semiconductor films, ceramic films, dielectric films, optical films, oxide films, hard films, PTFE films, and the like. Compared with similar equipment, this three-target magnetron sputtering coater is not only widely used, but also has the advantages of small size and easy operation, and is an ideal equipment for preparing material films in a laboratory.

Minimum Order: 1 bags

Magnetron sputtering is a kind of Physical Vapor Deposition (PVD).General sputtering method can be used to prepare metal, semiconductor, insulator and other materials, and has the advantages of simple equipment, easy control, large coating area and strong adhesion.Compared with similar equipment, this three-target magnetron sputtering coater is not only widely used, but also has the advantages of small size and easy operation, and is an ideal equipment for preparing material films in a laboratory. Three targets magnetron sputtering coater (500W DC&500W RF) can be used for preparing single-layer or multi-layer ferroelectric thin films, conductive films, alloy films, semiconductor films, ceramic films, dielectric films, optical films, oxide films, hard films, PTFE films, and the like.

Minimum Order: 1 bags

Magnetron sputtering is a kind of Physical Vapor Deposition (PVD).General sputtering method can be used to prepare metal, semiconductor, insulator and other materials, and has the advantages of simple equipment, easy control, large coating area and strong adhesion DC magnetron sputtering device can be used for preparing single-layer or multi- layer ferroelectric thin films, conductive films, alloy films, and the like. Compared with similar equipment, this three targets magnetron sputtering coater is not only widely used, but also has the advantages of small size and easy operation, and is an ideal equipment for preparing material films in a laboratory. Technical parameters 1.Sample stage Size:φ185mm Temperature control accuracy:±1℃ Heating temperature:Max 500℃ Rotate speed:1-20rpm adjustable 2.Magnetron Sputtering target head Quantity:2”×3 (1”,2” optional) Water chiller:Circulating water chiller with flow rate of 10L/min 3.Vacuum chamber Chamber size:φ300mm×300mm Watch window:φ100mm Chamber material:Stainless steel Opening mode:Top cover open 4.Mass flowmeter 2 channels; measuring   range 100sccm; 100sccm (can be customized according to customer needs) 5.Vacuum system Model:CY-GZK103-A Pumping interface:KF40 Molecular pump:CY-600 Exhaust interface:KF16 Backing pump:rotary vane pump Vacuum measurement:Compound vacuum gauge Ultimate vacuum:1.0E-5Pa Power supply:AC;220V 50/60Hz Pumping rate:Molecular pump:   600L/S  rotary vane pump: 1.1L/S   Comprehensive gas pumping performance: vacuum up to 1.0E-3Pa in 20 minutes 6.Power configuration DC power supply×3;Max output power:DC 500 W 7.Other parameters Supply voltage:AC220V,50Hz Overall size:600mm×650mm×1280mm Total power:3KW Total Weight:300kg

Minimum Order: 1 bags

Compared with similar plasma sputtering equipment, the three-target magnetron sputtering coating machine is not only widely used, but also has the advantages of small size and easy operation, and is an ideal equipment for preparing a material film in a laboratory. The device can be used for preparing single or multi-layer ceramic films, dielectric films, optical films, oxide films, hard films, PTFE films, and the like. Features 1.There are 1-inch or 2-inch magnetron targets for you to choose. Customers can choose the target according to the size of the substrate to be coated. 2.The device is equipped with three 300W RF power supply. The RF power supply can be used for the preparation of non-metal. The three targets can meet the needs of multi-layer or multiple coatings. If customers have other coating needs, DC power supply and pulse power supply can be customized. Various types of power supply are available from 300W to 1000W in various specifications. 3.The coating machine is equipped with two-channel high-precision mass flowmeter. If you have other requirements, you can customize the gas path of up to four- channel mass flowmeters to meet the complex gas environment construction requirements. 4.The instrument is equipped with advanced turbomolecular pump sets, the ultimate vacuum is up to 1.0E-5Pa, and other types of molecular pumps are available for purchase. Molecular pump gas path is controlled by multiple solenoid valves, you can open the chamber to take out the sample without shutting down the pump, greatly improving your work efficiency. 5.This product can be equipped with an integrated industrial computer to control the system. In the computer program, most functions such as vacuum pump control and sputtering power control can be realized, which can further improve your experimental efficiency.

Minimum Order: 1 bags

three target magnetron sputtering coater with UPS can be used for preparing single- layer or multi-layer ferroelectric thin films, conductive films, alloy films, semiconductor films, ceramic films, dielectric films, optical films, oxide films, hard films, PTFE films, and the like. Compared with similar vacuum PVD equipment, this three-target magnetron sputtering coater is not only widely used, but also has the advantages of small size and easy operation, and is an ideal equipment for preparing material films in a laboratory. Technical Parameters ***Supply Voltage:VAC 220, 60Hz UPS:20KVA 16KW, 1 hour delay,16 batteries, with capacity of 38AH ***Vacuum Chamber  Dimension: Dia. 325 mm * H 385 mm Material: 304 stainless steel Viewport (Window): ~4'' (100mm) with shutter ***Sample Stage  Top sample holder Sample table: Dia. 150mm Sample size: Max. 4'' diameter Rotary speed: 0-40rpm adjustable Heating temperature: up to 700oC ***Magnetron Sputtering Gun  3× 2'' magnetron sputter guns, with automatic shutter Sputtering orientation upwards Target diameter: 2'' Magnets: rare earth magnet ***Mass Flow Meter  3 × MFC mass flow control (Ar, O2 and N2) Measuring ranges: up to 20sccm With pneumatic isolation valve(s) and filter. ***Full Automatic control by PC or PLC, to control  Store for minimum 100 recipe,19'' Flat controller

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Dual-target RF magnetron sputtering coater can be used for preparing single-layer or multi-layer ferroelectric thin films, conductive films, alloy films, semiconductor films, ceramic films, dielectric films, optical films, oxide films, hard films, PTFE films, and the like. Compared with similar equipment, the dual- target magnetron sputtering coater is not only widely used, but also has the advantages of small size and easy operation, and is an ideal equipment for preparing material films in a laboratory. In addition, this machine is equipped with two high precision film thickness gauges, which can meet the film thickness detection requirements during the coating process. If customers need to install multiple film thickness gauges, also can contact our technical staff for customization. Technical parameter Sample stage Size:φ185mm Temperature control accuracy:±1℃ Heating temperature:Max 500℃ Rotate speed:1-20rpm adjustable Magnetron Sputtering   target head Quantity:2”×2 (1”,2” optional) Water chiller:Circulating water chiller   with flow rate of 10L/min Vacuum chamber Chamber size:φ300mm×300mm Watch window:φ100mm Chamber material:Stainless steel Opening mode:Top cover open Mass flowmeter 2 channels; measuring range 100sccm; 100sccm (can be customized according to customer needs) Vacuum system Model:CY-GZK103-A Pumping interface:KF40 Molecular pump:CY-600 Exhaust interface:KF16 Backing pump:rotary vane pump Vacuum measurement:Compound vacuum gauge Ultimate vacuum:1.0E-5Pa Power supply:AC;220V 50/60Hz Pumping rate:Molecular pump:   600L/S   rotary vane pump: 1.1L/S   Comprehensive gas pumping performance:   vacuum up to 1.0E-3Pa in 20 minutes Power configuration RF power supply×1;Max output power:RF 300 W DC power supply×1;Max output power:RF 500 W Other parameters Supply voltage:AC220V,50Hz Overall size:600mm×650mm×1280mm Total power:2.5KW Total Weight:About 300kg

Minimum Order: 1 bags

Dual-target DC magnetron sputtering coater CY-MSP300S-2DC is a cost-effective magnetron sputtering coating equipment independently developed by our company. It is standardized, modular and customizable. There are 1-inch or 2-inch magnetron targets for you to choose. Customers can choose the target according to the size of the substrate to be coated. The device is equipped with two 500W DC power supply. The DC power supply can be used for the preparation of metal film. The two targets can meet the needs of multi-layer or multiple coatings. The coating machine is equipped with two-channel high-precision mass flowmeter. If you have other requirements, you can customize the gas path of up to four-channel mass flowmeters to meet the complex gas environment construction requirements. The instrument is equipped with advanced turbomolecular pump sets, the ultimate vacuum is up to 1.0E-5Pa, and other types of molecular pumps are available for purchase. Molecular pump gas path is controlled by multiple solenoid valves, you can open the chamber to take out the sample without shutting down the pump, greatly improving your work efficiency. This product can be equipped with an integrated industrial computer to control the system. In the computer program, most functions such as vacuum pump control and sputtering power control can be realized, which can further improve your experimental efficiency. Application: This device can be used for preparing single-layer or multi-layer ferroelectric thin films, conductive films, alloy films, and the like. Compared with similar equipment, the dual-target magnetron sputtering coater is not only widely used, but also has the advantages of small size and easy operation, and is an ideal equipment for preparing material films in a laboratory.

Minimum Order: 1 bags

RF magnetron sputtering coating with 2 target can be used for preparing single or multi-layer ceramic films, dielectric films, optical films, oxide films, hard films, PTFE films, and the like. Compared with similar equipment, the dual-target magnetron sputtering coating machine is not only widely used, but also has the advantages of small size and easy operation, and is an ideal equipment for preparing a material film in a laboratory. Technical parameter Sample stage Size:φ185mm Temperature control accuracy:±1℃ Heating temperature:Max 500℃ Rotate speed:1-20rpm adjustable Magnetron Sputtering   target head Quantity:2”×2 (1”,2” optional) Water chiller:Circulating water chiller   with flow rate of 10L/min Vacuum chamber Chamber size:φ300mm×300mm Watch window:φ100mm Chamber material:Stainless steel Opening mode:Top cover open Mass flowmeter 2 channels; measuring range 100SCCM; 100SCCM (can be customized according to customer needs) Vacuum system Model:CY-GZK103-A Pumping interface:KF40 Molecular pump:CY-600 Exhaust interface:KF16 Backing pump:rotary vane pump Vacuum measurement:Compound vacuum gauge Ultimate vacuum:1.0E-5Pa Power supply:C;220V 50/60Hz Pumping rate:Molecular pump:   600L/S rotary vane pump: 1.1L/S Comprehensive gas pumping performance:   vacuum up to 1.0E-3Pa in 20 minutes Power configuration RF power supply×2;Max output power:RF 300 W Other parameters Supply voltage:AC220V,50Hz Overall size:600mm×650mm×1280mm Total power:2.5KW Total Weight:About 300kg

Minimum Order: 1 bags

Double target magnetron sputtering coater is a small laboratory coater with two targets developed by our company. It can be used to prepare single or multi-layer ferroelectric film, conductive film, alloy film, semiconductor film, ceramic film, dielectric film, optical film, etc. Compared with ordinary plasma sputtering, magnetron sputtering has the advantages of high energy, high speed, high coating rate and low sample temperature rise, which is a typical high-speed low-temperature sputtering. The magnetron target is equipped with a water-cooled inter layer, the water cooler can effectively take away heat, avoid heat gathering on the target surface, and make the magnetron coating work stably for a long time. In addition, the device is also equipped with bias power supply, which can add bias electric field between the target and the sample platform, enhance the energy of ions, improve the film quality and adhesion of the film. The whole machine adopts touch screen control, one key coating procedure, simple operation, and is an ideal equipment for preparing thin film in the laboratory..  Technical Parameters Voltage AC220V，50Hz,Power3KW Sample carrier  Sizeφ140mm,Heating temp：MAX.500℃,Accuracy：±1℃,Speed：1~20rp , m adjustable Magnetron sputtering head  Number: two,2-inch,Cooling mode:Water cooling,10L / min flow rate Vacuum Chamber  Size：φ300mm × 300mm H,Material：stainless steel,Observation window：φ100mm Opening mode：Open top, easy to replace the target Gas flow controller 2 ways: Ar, N2;Range 0-100sccm Ultimate vacuum 10-6 torr Vacuum pump:Molecular pump system, pumping speed: 600L/S Film thickness gauge Quartz vibrating film thickness gauge , resolution: 0.10 μ M Sputtering power supply  One DC power supply, 1000W, suitable for preparing metal film One RF power supply, 500W, suitable for non-metallic coating Operation mode Panel button operation Dimensions 1400mm × 750mm × 1300mm Weight 300 KG

Minimum Order: 1 bags

CY-MSP210S-RFDC desktop dual-target magnetron sputtering coating instrument. The equipment has been miniaturized, while retaining the high-vacuum stainless steel cavity, while simplifying other mechanisms, limiting the shape of the equipment to the desktop level, greatly reducing the installation site requirements. The equipment is equipped with a DC power supply and an RF power supply. The DC target can be used for sputtering of metals and other conductive materials. The RF power supply can be used for sputtering of various non-metals and metal oxides. The equipment vacuum system adopts all imported vacuum pumps, with fast pumping speed, high ultimate vacuum and excellent vacuum performance. The equipment has compact structure, perfect functions and easy to use. It is very suitable for various coating tests. Technical parameter Sample stage:Size:φ150mm;heating Up to 500℃;Rotating speed:0-20 adjustable Magnetron sputtering target 2” x2 dual targets share a baffle Vacuum chamber Cavity size:φ210mm X 230mm Observation window:φ40mm Cavity material:SS304 stainless steel Opening method:Front door Vacuum system Mechanical pump:Imported oil-free diaphragm pump Pumping interface:KF16 Molecular pump:Imported molecular pump Pumping interface:KF40 Vacuum measurement:Resistance gauge + ionization gauge Exhaust interface:KF16 Ultimate vacuum:1.0E-3Pa Power supply:AC 220V 50/60Hz Pumping rate:Oil-free pump 0.49L/s Molecular pump: 40L/S Sputtering power DC power supply x1 RF power supply x1 Maximum output power DC power supply 500W RF power supply 500W other Supply voltage:AC220V, 50Hz Overall size:550mm X 550mm X1100mm Total power:2kW

Minimum Order: 1 bags

Compared with similar vacuum PVD equipment, the single-target magnetron sputtering coater is not only widely used, but also has the advantages of small size and easy operation. It is an ideal equipment for laboratory preparation of material films, especially suitable for research on solid electrolyte and OLED in the laboratory.RF magnetron sputteringcan be used to prepare single-layer ceramic films, dielectric films, optical films, oxide films, hard films, PTFE films, and the like. Sample stage Size:φ185mm Temperature control accuracy:±1℃ Heating temperature:Max 500℃ Rotate speed:1-20rpm adjustable Magnetron Sputtering target head 2”×1 (1”,2”,3”optional) Circulating water chiller with flow rate of 10L/min Vacuum chamber Chamber size:φ300mm×300mm Watch window:φ100mm Chamber material:Stainless steel Opening mode:Top cover removable Mass flow meter 2 channels; measuring range 100sccm; 100sccm (can be customized according to customer needs) Vacuum system Model:CY-GZK103-A Pumping interface:KF40 Molecular pump:CY-600 Exhaust interface:KF16 Backing pump:rotary vane pump Vacuum measurement:Compound vacuum gauge Ultimate vacuum:1.0E-5Pa Power supply:AC;220V 50/60Hz Pumping rate:Molecular pump: 600L/S rotary vane pump: 1.1L/S Comprehensive gas pumping performance: vacuum up to 1.0E-3Pa in 20 minutes Power configuration RF power supply ×1;Max output power:300W Other parameters Supply voltage:AC220V,50Hz Overall size:600mm×650mm×1280mm Total power:2KW Total Weight:300kg

Minimum Order: 1 bags